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Product Parameters Model UVA LED CHIP UVB LED CHIP UVC LED CHIP POWER 0.5W-600W 0.5W-5W 0.5W-10W Dominant Wavelength 365nm 385nm 395nm 290-300nm 300-306nm 306-310nm 310-315nm 270-280nm 260-270nm 250-260nm 220-2...
Product Parameters Model UVA LED CHIP UVB LED CHIP UVC LED CHIP POWER 0.5W-600W 0.5W-5W 0.5W-10W Dominant Wavelength 365nm 385nm 395nm 290-300nm 300-306nm 306-310nm 310-315nm 270-280nm 260-270nm 250-260nm 220-2...
.../W 5,Flip chip technology 6,Stable performance 7,No parameters change Appilication: 1,Gym Lighting 2,Stadium Lighting 3,Grow Lighting 4,Sense Lighting 5,Outdoor ......
.../W 5,Flip chip technology 6,Stable performance 7,No parameters change Appilication: 1,Gym Lighting 2,Stadium Lighting 3,Grow Lighting 4,Sense Lighting 5,Outdoor ......
...CHIP Customization 250W 26V 95CRI for Photography lights products Specification: Model POWER CCT LM/W IF VF WHOLE SIZE EMIT SIZE VIEW ANGLE CRI 3538 SERIES 250W Five colors COB 620nm/460nm/520nm/2700K /6500K...
... 90 W/C:2.8A RGB:1A 21-24V 40X50MM 32MM 120° 95 Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separatio...
...CHIP Customization 250W 26V 95CRI for Photography lights products Specification: Model POWER CCT LM/W IF VF WHOLE SIZE EMIT SIZE VIEW ANGLE CRI 3538 SERIES 250W Five colors COB 620nm/460nm/520nm/2700K /6500K...
... Current 2100mA(Max=3A) Voltage 48-54V Chip Brand LG or SEOUL Warrnty 10,000Hrs or 2 years Factory Service Samples/Cutomized/Order PRODUCT PICTURE Appilcation: With ......
...Chips Cct 620nm/460nm/520nm/2700k /6500k Emit Size 32mm Cri 95 Product Details COBE POWER CCT LM/W IF VF WHOLE SIZE EMIT SIZE VIEW ANGLE CRI 4050 SERIES 180W Five color COB 620nm/460nm/520nm/2700K /6500K 90...
... 90/120 4.6A 42-45V 40X55MM 34MM 120 95 Mirror copper-aluminum combined substrate Cob Chip FAQ: Q1: Do you supply OEM,ODM service? A1: YES,absolutely it can be realized.Learnew focus on OEM & ODM service mor...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...