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Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
Design Advantage: 1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin ...
4055 Bi Color Led Cob Chip 200w+200w 2700-6500k 72-75v High Power Cob Led Chip 4055 cob chip Product detailed parameters Model POWER CCT LM/W IF VF WHOLE SIZE EMIT SIZE VIEW ANGLE CRI SUBSTRATE 4055 ......
... 90/120 4.6A 42-45V 40X55MM 34MM 120 95 Mirror copper-aluminum combined substrate Cob Chip FAQ: Q1: Do you supply OEM,ODM service? A1: YES,absolutely it can be realized.Learnew focus on OEM & ODM service mor...
... 90/120 4.6A 42-45V 40X55MM 34MM 120 95 Mirror copper-aluminum combined substrate Cob Chip FAQ: Q1: Do you supply OEM,ODM service? A1: YES,absolutely it can be realized.Learnew focus on OEM & ODM service mor...
...Chips Cct 620nm/460nm/520nm/2700k /6500k Emit Size 32mm Cri 95 Product Details COBE POWER CCT LM/W IF VF WHOLE SIZE EMIT SIZE VIEW ANGLE CRI 4050 SERIES 180W Five color COB 620nm/460nm/520nm/2700K /6500K 90...
High Current 470M Wirewound Chip Inductor 47UH SMD Power Inductor 1.Product Description The 470M Wirewound Chip Inductor is a wirewound chip inductor with an inductance value of 470 microhenries (µH) for high f...
...Chip Inductor High Efficiency for Automotive Application 1.Product Description The 4R7M SMT Chip Inductor, with an inductance value of 4.7 microhenries (denoted as 4R7), is a prevalent surface - mount techno...
...CHIP Product Details Model POWER CCT LM/W IF VF WHOLE SIZE EMIT SIZE VIEW ANGLE CRI SUBSTRATE 4055 SERIES 300W+300WDual Color Temperature 2700K/6500K 90/120 3.9A 72V-72V 40X55MM 34MM 120 95 Mirror copper-alu...
...CHIP Product Details Model POWER CCT LM/W IF VF WHOLE SIZE EMIT SIZE VIEW ANGLE CRI SUBSTRATE 4055 SERIES 300W+300WDual Color Temperature 2700K/6500K 90/120 3.9A 72V-72V 40X55MM 34MM 120 95 Mirror copper-alu...
...CHIP Product Details Model POWER CCT LM/W IF VF WHOLE SIZE EMIT SIZE VIEW ANGLE CRI SUBSTRATE 4055 SERIES 300W+300WDual Color Temperature 2700K/6500K 90/120 3.9A 72V-72V 40X55MM 34MM 120 95 Mirror copper-alu...
... ANGLE CRI SUBSTRATE 2424SERIES 40W+40WBi Color LED Chip 2800K/6500K 100/110 1100MA 36V-38V 24X24MM 21MM 120 95 Mirror copper-aluminum combined substrate Two-color COB (Chip-on-Board) LED lamps have many adv...
...electrical separation copper substrate + aluminum nitride structure COB (Chip on Board) LED is an LED packaging technology that directly connects LED chips to the PCB substrate instead of using traditional L...