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...Cost-Efficient Applications Core Processor STM8 Core Size 8-Bit Speed 24MHz Connectivity I²C, IrDA, LINbus, SPI, UART/USART Peripherals Brown-out Detect/Reset, POR, PWM, WDT Number of I/O 52 Program Memory S...
... is manufactured by Atmel, and provides up to 32kb of Flash memory, 256 bytes of RAM, and 4kb of EEPROM. The AT89S51-24AU is a low-power, low-cost solution for embedded applications and is designed to be eas...
... of Flash Programmable and Erasable Read Only Memory (PEROM) and 256 bytes of RAM. This chip is ideal for applications requiring a low-power, low-cost microcontroller with advanced features such as an enhanc...
...cost and optimized feature set of Cyclone II FPGAs make them ideal solutions for a wide array of automotive, consumer, communications, video processing, test and measurement, and other end-market solutions. ...
... interfaces and I/O protocols required in low-cost applications. Specification Of EP2C35U484C6 Part Number EP2C35U484C6 Number of LABs/CLBs 2076 Total RAM Bits 483840 Voltage - Supply 1.15V ~ 1.25V Operating...
... low-cost 32-bit MCUs operating at CPU frequencies of up to 50MHz. Specification Of LPC11U35FBD48/40EL Part Number: LPC11U35FBD48/40EL EEPROM Size: 4K x 8 RAM Size: 10K x 8 Voltage - Supply (Vcc/Vdd): 1.8V ~...
...cost and power with small form-factor packaging for high-volume automotive applications. Specification Of XA7S6-1CSGA225Q Part Number XA7S6-1CSGA225Q Number of LABs/CLBs 469 Number of Logic Elements/Cells 60...
...-cost-per I/O programmable platform aimed at expanding system capabilities and bridging emerging connectivity interfaces using both parallel and serial I/O. Specification Of LCMXO3L-1300C-5BG256I Part Number...
...lowest cost per I/O. The device I/O features have the integrated support for latest industry standard I/O. Specification Of LCMXO3L-6900C-5BG256I Part Number LCMXO3L-6900C-5BG256I Number of LABs/CLBs 858 Num...
...a low-cost solution for a wide range of embedded designs that require complex code and higher feature integration. Specification Of PIC32MX550F256H-I/PT Part Number PIC32MX550F256H-I/PT Program Memory Size: ...
EP3C25E144I7N 82 I/O 144EQFP Low Cost FPGA IC Chip Manufacturer Intel FPGAs/Altera Series Cyclone® III Part Status Active Number of LABs/CLBs 1539 Number of Logic Elements/Cells 24624 Total RAM Bits 608256 Numb...
... a high-performance, cost-competitivemotor control solution. Specification Of MKV31F512VLL12 Part Number MKV31F512VLL12 Number of I/O 70 Program Memory Size 512KB (512K x 8) Program Memory Type FLASH RAM Siz...
...pin low cost general purpose MCU family. All members of the MC9S12E-Family are comprised of standard on-chip peripherals including a 16-bit central processing unit (HCS12 CPU), up to 256K bytes of Flash EEPR...
...Ram Rod Extruder PFB150 Through continuous improvement, the equipment is smarter, more stable and more efficient. The equipment is controlled by PLC system, and operated automatically with simple operation. ...
...-of-the-art technology, combined with innovative circuit design techniques, provides a cost-effective solution for high-speed memory needs. The IDT71V416 has an output enable pin which operates as fast as 5n...
...-of-the-art technology, combined with innovative circuit design techniques, provides a cost-effective solution for high-speed memory needs. The IDT71V416 has an output enable pin which operates as fast as 5n...
...-of-the-art technology, combined with innovative circuit design techniques, provides a cost-effective solution for high speed memory needs. The JEDEC center power/GND pinout reduces noise generation and impr...
... Core i7/i5/i3, Pentium, and Celeron processors on the LGA1150 socket. With dual DDR3 memory slots, it can handle up to 16GB of RAM, making it...
... floors during construction and renovation – protect your flooring investment with Ram Board. Let our temporary floor protection help you avoid costly repairs Product Specifications Name Construction-Grade T...
... Color Image show RAM CI5 3.0GHZ 4GB Keyword Diebold PC Core 49249260300A Weight 5kg Packaging & Shipping 1. Packaging: Thickening international standard export package or customized. 2. Shipping: By Air, by...