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Total 47770 products for dip ic package Manufacture & Suppliers

TDA1517P/N3 112 Audio Frequency Amplifier DIP IC Chip 15w 18 Pin

TDA1517P/N3 Audio frequency amplifier DIP ic chips Products Description: 1. Requires very few external components 2. High output power 3. Fixed gain 4. Good ripple rejection 5. Mute/standby switch 6. AC and DC ...

SHENZHEN ECER NETWORK TECHNOLOGY CO.,LTD
Guangdong,China

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UL 94V 0 28 Pin Dip IC Socket Round Hole 7.62mm Connector Moisture Proof

...Dip IC Socket Round Hole 7.62mm Connector Moisture Proof Forces polished steel gauga Φ0.43mm Insertion 200g Max/Pin, Withdrawal:60g Min/Pin Operation Temperature ﹣40℃ to +105℃ Sleeve Brass CuZn36Pb3(C36000),...

Shenzhen Realrun Electronic Co., Ltd.
Guangdong,China

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UL 94V 0 28 Pin Dip IC Socket Round Hole 7.62mm Connector Moisture Proof

...Dip IC Socket Round Hole 7.62mm Connector Moisture Proof Forces polished steel gauga Φ0.43mm Insertion 200g Max/Pin, Withdrawal:60g Min/Pin Operation Temperature ﹣40℃ to +105℃ Sleeve Brass CuZn36Pb3(C36000),...

Shenzhen Realrun Electronic Co., Ltd.
Guangdong,China

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2 Layers IC Package Substrate Palladium Gold COF Electric Annoyed Liquid Crystal Drive

2 layers of COF,electric annoyed liquid crystal drive,IC Package Substrate,palladium gold,ic package,pcb production Product Description Product area: electric annoyed liquid crystal drive Number of layers: 2 la...

Shenzhen Chaosheng Electronic Technology Co.,Ltd
Hong Kong,China

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CDSOT23-SM712 CE6230B33M CF0505XT-1WR2 CH451L BOURNS CHIPOWER MONRSUN WCH SOT23 SMD DIP ICs Chip

...ICs) CDSOT23-SM712 CE6230B33M CF0505XT-1WR2 CH451L BOURNS CHIPOWER MONRSUN WCH SOT23 SMD DIP Integrated Circuits Components Specification :CDSOT23-SM712 CE6230B33M CF0505XT-1WR2 CH451L Category Integrated Ci...

HK NeoChip Technology Limited
China

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MAX690CPA+ Electronic IC Chips Color TV IC Chip DIP-8 Package 0.3V - 6V

MAX690CPA+ WR Electronic Component Electronic Ic Chip Color TV Ic chip ic diode 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH +-15-kV ESD PROTECTION FEATURES: �� ESD Protection for RS-232 Bus Pins ��...

ChongMing Group (HK) Int'l Co., Ltd
China

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DIP IC Sockets 7.62mm Row Space Round 2x8 Pin Header 2.54mm Gold Plated

DIP IC Sockets 7.62mm Row Space Round 2x8 Pin Header 2.54mm Gold Plated DIP IC Sockets 7.62mm Row Space Round 2x8 Pin Header 2.54mm Gold Plated Specifications Insulator Material PBT ......

SHENZHEN JRKCONN ELECTRONICS CO.,LTD
Guangdong,China

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DIP IC Socket Connectors Adaptor Black Solder Header Pins Round Pins Female Pcb Header

DIP IC Socket Connectors Adaptor Black Solder Header Pins Round Pins Female Pcb Header DIP IC Socket Connectors Adaptor Black Solder Header Pins Round Pins Female Pcb Header Specifications Housing Material Glas...

SHENZHEN JRKCONN ELECTRONICS CO.,LTD
Guangdong,China

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SN74AHC86DR IC Chip Quad 2-Input Exclusive-OR Gate DIP-14 Package Case 14-SOIC

Product Listing: Product Name: SN74AHC86DR Quadruple Exclusive-OR Gate Product Number: SN74AHC86DR Manufacturer: Texas Instruments Package Type: SOIC-14 Technology: CMOS Voltage - Supply: 2 V ~ 6 V Operating Te...

Shenzhen Sai Collie Technology Co., Ltd.
China

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2.54mm Turned Pin Contact Type DIP IC Socket With Pin Length 7.43mm

2.54mm Turned Pin Contact Type DIP IC Socket With Pin Length 7.43mm Description: DIP IC socket is an electrical connector used in the field of electronic engineer. The turned pin contact usually has tapered ent...

Ningbo Anyo Import & Export Co., Ltd.
Zhejiang,China

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ESD Plastic JEDEC Standard Matrix Tray For IC Packaging

... is the packaging tray used by the enterprise for its chip packaging test. Because the IC chip is small and thin, the enterprise will generally take external protection to avoid scratches and damage. JEDEC M...

Shenzhen Hiner Technology Co., Ltd.
Guangdong,China

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BGA QFP QFN LGA PGA IC Type JEDEC Trays Surface Resistant Suitable For IC Packaging

BGA QFP QFN LGA PGA IC Type JEDEC Trays Surface Resistant Suitable For IC Packaging Looking for a durable, heat-resistant tray for IC packaging? This JEDEC tray combines quality materials with exacting standard...

Shenzhen Hiner Technology Co., Ltd.
Guangdong,China

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EMV Dip IC Hybrid Card Reader / Magnetic Card Readers And Writers For Utility

EMV Dip IC Hybrid Card Reader / Magnetic Card Readers And Writers For Utility Description: �� IC&RF card read &write �� Automatically lock the card,manual/auto card ejection �� Special design for protecting reader...

CREATOR (CHINA) TECH CO., LTD
Guangdong,China

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EMV Dip IC Hybrid Card Reader / Magnetic Card Readers And Writers For Utility

EMV Dip IC Hybrid Card Reader / Magnetic Card Readers And Writers For Utility Description: �� IC&RF card read &write �� Automatically lock the card,manual/auto card ejection �� Special design for protecting reader...

CREATOR (CHINA) TECH CO., LTD
Guangdong,China

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High Storage Efficiency Lightweight JEDEC Tray with ESD Protection for IC Packaging

...IC Packaging Designed for high-level semiconductor cleanroom environments, this tray minimizes contamination and ensures IC integrity. Key Features/ Benefits Lower cost solution Lightweight design High stora...

Shenzhen Hiner Technology Co., Ltd.
Guangdong,China

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ADP1613ARMZ-R7 Power Management ICs Boost SEPIC Switching Regulator IC Package 8-TSSOP 8-MSOP63

ADP1613ARMZ-R7 Power Management ICs Boost SEPIC Switching Regulator IC Package 8-TSSOP 8-MSOP Product Status Active Function Step-Up Output Configuration Positive Topology Boost, SEPIC Output Type ......

Shenzhen Sai Collie Technology Co., Ltd.
China

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MAX8815AETB+T Power Management ICs Boost Switching Regulator IC Package 10-WFDFN Exposed Pad

MAX8815AETB+T Power Management ICs Boost Switching Regulator IC Package 10-WFDFN Exposed Pad Product Status Active Function Step-Up Output Configuration Positive Topology Boost Output ......

Shenzhen Sai Collie Technology Co., Ltd.
China

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Universal JEDEC Matrix Tray Stackable For IC Packaging Industry

Universal JEDEC Matrix Tray Stackable For IC Packaging Industry Offering both standard and custom configurations, our JEDEC trays meet a wide range of semiconductor packaging needs. This JEDEC matrix tray is cr...

Shenzhen Hiner Technology Co., Ltd.
Guangdong,China

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Injection JEDEC Tray With Custom Cavity Design For IC Packaging And Shipping

Injection JEDEC Tray With Custom Cavity Design For IC Packaging And Shipping Need packaging that integrates into your existing process? Our JEDEC trays are automation-ready and tailor-made for your workflow. Th...

Shenzhen Hiner Technology Co., Ltd.
Guangdong,China

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Anti-Static And Automation Ready Custom JEDEC Tray For IC Packaging

Anti-Static And Automation Ready Custom JEDEC Tray For IC Packaging Protect and transport your ICs with confidence��our JEDEC trays meet industry standards and adapt to your exact chip form factor. This JEDEC-co...

Shenzhen Hiner Technology Co., Ltd.
Guangdong,China

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Dip Ic Package

Total 47770 products for dip ic package Manufacture & Suppliers

TDA1517P/N3 112 Audio Frequency Amplifier DIP IC Chip 15w 18 Pin

UL 94V 0 28 Pin Dip IC Socket Round Hole 7.62mm Connector Moisture Proof

UL 94V 0 28 Pin Dip IC Socket Round Hole 7.62mm Connector Moisture Proof

2 Layers IC Package Substrate Palladium Gold COF Electric Annoyed Liquid Crystal Drive

CDSOT23-SM712 CE6230B33M CF0505XT-1WR2 CH451L BOURNS CHIPOWER MONRSUN WCH SOT23 SMD DIP ICs Chip

MAX690CPA+ Electronic IC Chips Color TV IC Chip DIP-8 Package 0.3V - 6V

DIP IC Sockets 7.62mm Row Space Round 2x8 Pin Header 2.54mm Gold Plated

DIP IC Socket Connectors Adaptor Black Solder Header Pins Round Pins Female Pcb Header

SN74AHC86DR IC Chip Quad 2-Input Exclusive-OR Gate DIP-14 Package Case 14-SOIC

2.54mm Turned Pin Contact Type DIP IC Socket With Pin Length 7.43mm

ESD Plastic JEDEC Standard Matrix Tray For IC Packaging

BGA QFP QFN LGA PGA IC Type JEDEC Trays Surface Resistant Suitable For IC Packaging

EMV Dip IC Hybrid Card Reader / Magnetic Card Readers And Writers For Utility

EMV Dip IC Hybrid Card Reader / Magnetic Card Readers And Writers For Utility

High Storage Efficiency Lightweight JEDEC Tray with ESD Protection for IC Packaging

ADP1613ARMZ-R7 Power Management ICs Boost SEPIC Switching Regulator IC Package 8-TSSOP 8-MSOP63

MAX8815AETB+T Power Management ICs Boost Switching Regulator IC Package 10-WFDFN Exposed Pad

Universal JEDEC Matrix Tray Stackable For IC Packaging Industry

Injection JEDEC Tray With Custom Cavity Design For IC Packaging And Shipping

Anti-Static And Automation Ready Custom JEDEC Tray For IC Packaging