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...Molding System Semiconductor packaging equipment is mainly used in TO, SOP, SSOP, TSSOP, DIP, SOT, ESOT, SOD, QFN, SMA, SMC, SMBF, MBF, JA, QFP, IPM, BGAPDFNOFP and other semiconductor devices, IC , Chip one...
ODM PCB Module ESD Black IC Packaging Trays Heat-Resistant Go beyond off-the-shelfget JEDEC trays engineered for your chips shape, height, and transportation needs. While the JEDEC Tray is widely used in the ...
FSBB20CH60C Automotive IGBT Modules 600V 20A Intelligent Power Module DIP-27 Package Product Description Of FSBB20CH60C FSBB20CH60C is an advacned Motion SPM 3 series that has newly developed to provide a very...
MAX3232CPE RS-232 Transceiver andplusmn;15kV ESD Protection 3.0-5.5V Wide Voltage 1andmu;A Low Power 250kbps Data Rate 2 Drivers/2 Receivers DIP-16 Package for Industrial Comms andnbsp; Benefits and Features ...
... line spacing 0.009/0.009mil, nickel palladium Quantities range from prototype to volume production. 100% E-Test Packing: vacuum packaging + desiccant +...
High Heat Dissipation Hermetic Packages Electronics Mo50Cu50 Heat Spreader For IC Packages Description: Mo-Cu heat sink material is a composite of molybdenum and copper, its thermal expansion coefficient and th...
744774022 Original SMD / SMT Fixed Inductors Wurth Elektronik Product Category: Fixed Inductors RoHS: Details Product: Power Inductors Type: Wirewound Termination Style: SMD/SMT Shielding: Unshielded Inductance...
ZSS-120-02-S-D-515 Through Hole Headers & Wire Housings Samtec Product Category: Headers & Wire Housings RoHS: Details Product: Headers Number of Positions: 40 Position Pitch: 2.54 mm Number of Rows: 2 Row Row ...
744774022 Original SMD Fixed Inductor WE-PD2 5848 2.2uH 4.6A .041Ohm Product Category: Fixed Inductors RoHS: Details Product: Power Inductors Type: Wirewound Termination Style: SMD/SMT Shielding: Unshielded Ind...
744774022 Original SMD Fixed Inductor WE-PD2 5848 2.2uH 4.6A .041Ohm Product Category: Fixed Inductors RoHS: Details Product: Power Inductors Type: Wirewound Termination Style: SMD/SMT Shielding: Unshielded Ind...
... card,Flash memory card,DDR,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;IC package,Semiconductor package,Memory electronics,NAND/Flas...
LM358P IC OPAMP GP 2 CIRCUIT 8DIP Texas Instruments Product Details LM358P Description These circuits consist of two independent, high gain, internally frequency compensated which were designed specifically to ...
...provide a visual indicator of the Pin 1 orientation of the IC and prevent the stack of errors, reduce the possibility of workers making mistakes, and maximize the protection of the chip. Providing a variety ...
Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,telecommunication electronics,consumer electronics,Storage IC substrage;IC package,Semiconductor package,Memory electronics,NAND/Fl...
...a IC packaging parts auto cleaning system with trial chemical wash sections. SC830 is a high wash ability FC packaging deflux cleaning system. 810 IC packaging auto cleaing machine is used to clean flux resi...
...game - changer in the field of high - reliability IC packaging. Made of high - purity silver, this bonding wire offers excellent electrical conductivity, ensuring efficient signal transmission in ICs. The co...
Application:IC substrate package,Wifi module/Bluetooth module,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Sp...
BGA IC Packaging Black JEDEC Matrix Trays ESD Stable Surface BGA IC Packaging Solution ESD Stable Surface Resistance Matrix Tray JEDEC Tray/Matrix Tray/IC Tray/ESD Packing Tray Antistatic trays are among those ...
Application:Semi Package,LED chip package,Semiconductors ,Semiconductor,IC package,miniLED,MicroLED,MEMS,IC assembly,Storage IC substrage; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finishe...