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UL94 V-0 Clear Epoxy Potting Compound 5:1 Two Component Encapsulant for EV Onboard Charger Module HN-5508AB is a clear two-component epoxy potting compound with a 5:1 mix ratio, specially formulated for EV onbo...
Automotive ECU Epoxy Potting Compound Two Component 5:1 Clear Encapsulant Resin For Electronic Control Units This two component 5:1 clear epoxy potting compound is engineered for automotive ECU and electronic c...
HANAST HN-5508 A/B Customized Black Epoxy Potting Compound 5:1 for LED Driver & Electronics Encapsulation HN-5508 A/B is a customizable two-component black epoxy potting compound developed for the electronics i...
... potting compound engineered for chemical and mechanical protection of industrial electronics. Mixed at a 5:1 ratio by weight, it flows with low viscosity and long pot life, ......
...CTE Matched Thermal Cycling Resistant Epoxy Potting Compound for Motor Stator and Power Module Encapsulation HN-5508 A/B is a two-component, room-temperature or heat-curable epoxy potting compound engineered...
Transparent Epoxy Potting Compound 2:1 Self-Leveling AB Glue 70 Shore D for Wind Turbine Converter Encapsulation HN-5506A/B is a high-transparency two-component epoxy potting compound with a 2:1 mix ratio, spec...
HANAST HN-5506 A/B High Transparency High Voltage Epoxy Potting Compound for Power Module and High-Voltage Encapsulation HN-5506 A/B is a two-component, high-transparency epoxy potting compound with high hardne...
HANAST HN-5506 A/B High Transparency Epoxy Potting Compound for Industrial Sensor Housing and High-Voltage Encapsulation HN-5506 A/B is a two-component, high-transparency epoxy potting compound with high hardne...
Clear Epoxy Potting Compound 2:1 Self-Leveling Low Viscosity AB Glue for Narrow Gap Electronic Component Encapsulation HN-5506A/B is a clear two-component epoxy potting compound with a 2:1 mix ratio, specially ...
HANAST HN-5508 A/B Waterproof Electrical Epoxy Potting Compound 200kg for Electronics Encapsulation HN-5508 A/B is a two-component, waterproof electrical epoxy potting compound developed for the electronics and...
...5508 A/B 5:1 Flame Retardant Epoxy Potting Compound for EV Battery, Power Module and New-Energy Electronics Encapsulation HN-5508 A/B is a two-component, room-temperature or heat-curable epoxy potting compou...
HANAST HN-5508 A/B 5:1 Black Epoxy Potting Compound for Transformer, Power Supply and Sensor Encapsulation HN-5508 A/B is a two-component, room-temperature or heat-curable epoxy potting compound developed for t...
...-5508 A/B Low Outgassing Black Epoxy Potting Compound for Hydrogen Fuel Cell, Vacuum Electronics and Power Module Encapsulation HN-5508 A/B is a two-component, room-temperature or heat-curable epoxy potting ...
...High Reliability Electronics Grade Epoxy Potting Compound for Power Module, Aerospace and Defense Electronics Protection HN-5508 A/B is a two-component, room-temperature or heat-curable epoxy potting compoun...
... potting compound formulated for electronics-grade, medical-device encapsulation. Mixed at a 5:1 ratio by weight, it flows with low viscosity and a long pot life, ......
...HN-5508 A/B 85-95 Hardness Electrical Epoxy Potting Compound for Temperature Sensors & Controllers HN-5508 A/B is a two-component, room-temperature or heat-curable epoxy potting compound developed for the el...
HANAST HN-5506 A/B High Transparency UV Resistant Epoxy Potting Compound for LED Display Module and Optical Encapsulation HN-5506 A/B is a two-component, high-transparency epoxy potting compound with high hardn...
Clear Epoxy Potting Compound 5:1 High Hardness 80 Shore D Waterproof Insulating Resin for Electric Motor Stator Encapsulation HN-5508AB is a clear two-component epoxy potting compound with a 5:1 mix ratio, spec...
Transparent Epoxy Potting Compound 5:1 High Hardness Waterproof Insulating Resin for 5G Base Station Power Supply HN-5508AB is a transparent two-component epoxy potting compound with a 5:1 mix ratio, specially ...
...Viscosity Thermally Conductive Black Epoxy Potting Compound for Power Module and Automated Dispensing Encapsulation HN-5508 A/B is a two-component, room-temperature or heat-curable epoxy potting compound eng...