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ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion® ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops 100MHz 208-PQFP (28x28)...
ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion® ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops 80MHz 484-FPBGA (23x23)...
ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion® ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops 80MHz 208-PQFP (28x28)...
ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion® ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops 100MHz 208-PQFP (28x28)...
ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion® ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops 100MHz 256-FPBGA (17x17)...
ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion® ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops 100MHz 484-FPBGA (23x23)...
... P1.87mm Pixel Density 1,638,400 1,137,777 640,000 409,600 284,444 LED Chip Flip Chip Module Size 150*168.75mm(W*H)...
... Bonding Flip chip Unwinding chip side up Thickness 0.07mm Operation Temp. -20°C~+65°C Storage Temp. -25°C~+65°C Date Storage ≥10 years Packing ......
...LED SMD technology? 1.The flip-chip COB package uses MIni/Micro LED chips. 2.lt is directly integrated and packaged on the PCB board through solid crystal and molding methods. 3.Simplified the packaging proc...
...LED SMD technology? 1.The flip-chip COB package uses MIni/Micro LED chips. 2.lt is directly integrated and packaged on the PCB board through solid crystal and molding methods. 3.Simplified the packaging proc...
...LED SMD technology? 1.The flip-chip COB package uses MIni/Micro LED chips. 2.lt is directly integrated and packaged on the PCB board through solid crystal and molding methods. 3.Simplified the packaging proc...
...LED SMD technology? 1.The flip-chip COB package uses MIni/Micro LED chips. 2.lt is directly integrated and packaged on the PCB board through solid crystal and molding methods. 3.Simplified the packaging proc...
...LED SMD technology? 1.The flip-chip COB package uses MIni/Micro LED chips. 2.lt is directly integrated and packaged on the PCB board through solid crystal and molding methods. 3.Simplified the packaging proc...
...LED SMD technology? 1.The flip-chip COB package uses MIni/Micro LED chips. 2.lt is directly integrated and packaged on the PCB board through solid crystal and molding methods. 3.Simplified the packaging proc...
...LED SMD technology? 1.The flip-chip COB package uses MIni/Micro LED chips. 2.lt is directly integrated and packaged on the PCB board through solid crystal and molding methods. 3.Simplified the packaging proc...
...LED SMD technology? 1.The flip-chip COB package uses MIni/Micro LED chips. 2.lt is directly integrated and packaged on the PCB board through solid crystal and molding methods. 3.Simplified the packaging proc...
...LED SMD technology? 1.The flip-chip COB package uses MIni/Micro LED chips. 2.lt is directly integrated and packaged on the PCB board through solid crystal and molding methods. 3.Simplified the packaging proc...
...LED SMD technology? 1.The flip-chip COB package uses MIni/Micro LED chips. 2.lt is directly integrated and packaged on the PCB board through solid crystal and molding methods. 3.Simplified the packaging proc...
...LED SMD technology? 1.The flip-chip COB package uses MIni/Micro LED chips. 2.lt is directly integrated and packaged on the PCB board through solid crystal and molding methods. 3.Simplified the packaging proc...
...LED SMD technology? 1.The flip-chip COB package uses MIni/Micro LED chips. 2.lt is directly integrated and packaged on the PCB board through solid crystal and molding methods. 3.Simplified the packaging proc...