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... 2, The latest Eutectic Flip-chip bonding with Cree Chips, Thermoelectric solution, fast heat-conductivity between LEDs and MCPCB substrate 3, Unique Parallel and Serial connection of LED design, Lower ......
...spot lighting,far distance projection illumination 2, The latest Eutectic Flip-chip bonding with Cree Chips, Thermoelectric solution, fast heat-conductivity between LEDs and MCPCB substrate 3, Unique Paralle...
...Flip-chip LEDs, Quality assured LED Components for Entertainment Lighting products; Eutectic bonding to make sure the fast conductivity of heat, it's aim to the lumen maintenance; Small Light Emiting surface...
...Flip-chip LEDs, Quality assured LED Components for Entertainment Lighting products; Eutectic bonding to make sure the fast conductivity of heat, it's aim to the lumen maintenance; Small Light Emiting surface...
... Vertical / Flip-chip LEDs Eutectic bonding to make sure the fast conductivity of heat, it's aim to the lumen maintenance; Small Light Emiting surface(LES) to enhance the light density; Using copper MCPCB to...
... 2, The latest Eutectic Flip-chip bonding with Cree Chips, Thermoelectric solution, fast heat-conductivity between LEDs and MCPCB substrate 3, Unique Parallel and Serial connection of LED design, Lower ......
300watt 42V LED Light Engine White 6000K - 8000K CREE Flip-chip LED Features: 1. Excellent Transiting Heat from LED Chip Operating under 7.5A 2. High Luminous Output 3. No UV 4. Light emitting area is small, po...
...Chip 200lm Specification: Item Code Color IF (mA) VF (V) λd (nm) CCT (°K) Beam Angle (°) Lumen (lm) LES (mm) TX-3535RGBW3FC120- OGVEND34-01 (3W) R 250 2.0-2.6 615-625 120 30-46 Φ2.8 G 250 3.0-3.4 518-528 42-...
...Vertical / Flip-chip LEDs Eutectic bonding to make sure the fast conductivity of heat, it's aim to the lumen maintenance; Small Light Emiting surface(LES) to enhance the light density; Using copper MCPCB to ...
...spot lighting,far distance projection illumination 2, The latest Eutectic Flip-chip bonding with Cree Chips, Thermoelectric solution, fast heat-conductivity between LEDs and MCPCB substrate 3, Unique Paralle...
... Vertical / Flip-chip LEDs Eutectic bonding to make sure the fast conductivity of heat, it's aim to the lumen maintenance; Small Light Emiting surface(LES) to enhance the light density; Using copper MCPCB to...
...Vertical / Flip-chip LEDs Eutectic bonding to make sure the fast conductivity of heat, it's aim to the lumen maintenance; Small Light Emiting surface(LES) to enhance the light density; Using copper MCPCB to ...
...Vertical / Flip-chip LEDs Eutectic bonding to make sure the fast conductivity of heat, it's aim to the lumen maintenance; Small Light Emiting surface(LES) to enhance the light density; Using copper MCPCB to ...
...Brightness Vertical / Flip-chip LEDs Eutectic bonding to make sure the fast conductivity of heat, it's aim to the lumen maintenance; Small Light Emiting surface(LES) to enhance the light density; Using coppe...
...Lenses, anti polarized light and anti color cast; Adopting Eutectic bonding packaging technique with flip-chips, conductivity reach 120-160 W/m-k to enable a longer lifespan; Variable CCT-tunning from 2700K-...
...Lenses, anti polarized light and anti color cast; Adopting Eutectic bonding packaging technique with flip-chips, conductivity reach 120-160 W/m-k to enable a longer lifespan; Variable CCT-tunning from 2700K-...
...anti polarized light and anti color cast; Adopting Eutectic bonding packaging technique with flip-chips, conductivity reach 120-160 W/m-k to enable a longer lifespan; Variable CCT-tunning from 2700K-7000K, d...
... or Lenses, anti polarized light and anti color cast; Adopting Eutectic bonding packaging technique with flip-chips, conductivity reach 120-160 W/m-k to enable a longer lifespan; Variable CCT-tunning from 27...
...ough optics reflectors or Lenses, anti polarized light and anti color cast; Adopting Eutectic bonding packaging technique with flip-chips, conductivity reach 120-160 W/m-k to enable a longer lifespan; Variab...
...: Cross-distribution of LED chips in a circular LES to perform a better color-mixing through optics reflectors or Lenses, anti polarized light and anti color cast; Adopting Eutectic bonding packaging techniq...