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Total 1468 products for flip chips Manufacture & Suppliers

Unicomp AX9100max X-ray Machine High-Performance for IGBT Inspection in Various Industries

... inspection system specially designed for IGBT inspection and other advanced applications. It is widely used across multiple industries, including: Semiconductors: BGA, CSP, Flip Chip, Diode, IGBT Electronic...

Unicomp Technology
Guangdong,China

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Unicomp AX9100max X-ray Machine 130kV For IGBT Testing

Unicomp AX9100max X-ray Machine 130kV For IGBT Testing The Unicomp AX9100max X-ray Machine is designed for IGBT inspection and widely applied in various industries including BGA, CSP, Flip Chip, LED, Fuse, Diod...

Unicomp Technology
Guangdong,China

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Unicomp AX9100max X-ray Machine 130kV For IGBT Testing

... such as BGA/CSP/Flip Chip packaging, LED and optoelectronic component manufacturing, fuse and diode production, PCB and semiconductor assembly, battery fabrication, small metal ......

Unicomp Technology
Guangdong,China

Verified Supplier

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Unicomp AX9100max X-ray Machine For Cylindrical Power Cell

Unicomp AX9100max X-ray Machine For Cylindrical Power Cell Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cable...

Unicomp Technology
Guangdong,China

Verified Supplier

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Unicomp AX9100max X-ray Machine For EV Cylindrical Cell

... AX9100max X-ray Machine is designed for EV Cylindrical Cell inspection and is widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic ...

Unicomp Technology
Guangdong,China

Verified Supplier

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Unicomp AX8300MAX 110KV X-ray Inspection for Internal Cracks in Ceramic Components

Unicomp AX8300MAX 110KV X-ray Inspection for Internal Cracks in Ceramic Components Application BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die casting ,molded plastic; Cera...

Unicomp Technology
Guangdong,China

Verified Supplier

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Unicomp 110KV X-ray Inspection for MOSFET Void Detection and Reliability Analysis AX8300MAX

Unicomp AX8300MAX 110KV X-ray Inspection for Internal Cracks in Ceramic Components Application BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die casting ,molded plastic; Cera...

Unicomp Technology
Guangdong,China

Verified Supplier

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110kV Sealed Tube High Precision IC Semiconductor Component Xray Equipment AX8300MAX Unicomp Quality Control

110kV Sealed Tube High Precision IC Semiconductor Component Xray Equipment AX8300MAX Unicomp Quality Control Application BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die cas...

Unicomp Technology
Guangdong,China

Verified Supplier

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Tilt BGA Solder Joint Electronics Xray Inspection Machine AX8300MAX Unicomp Auto Void Analysis

... This system is widely applicable to semiconductor packaging (BGA, CSP, LED, Flip Chip), automotive parts, new energy industry components, aluminum die castings, injection molded plastics, ceramic products a...

Unicomp Technology
Guangdong,China

Verified Supplier

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360° Rotation CNC Automatic MOSFET PCB Assembly Xray Inspection System AX8300MAX Unicomp Stable Performance

Tilt BGA Solder Joint Electronics Xray Inspection Machine AX8300MAX Unicomp Auto Void Analysis Application This system is widely applicable to semiconductor packaging (BGA, CSP, LED, Flip Chip), automotive part...

Unicomp Technology
Guangdong,China

Verified Supplier

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90kV 5μm Resolution Bonding Wire Semiconductor Xray Tester CX3000 Unicomp Gold Bond Inspection Equipment

... X-ray Tester for precise inspection and quality control. Applications BGA, CSP, LED, Flip Chip, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Aerospace Components, Photo...

Unicomp Technology
Guangdong,China

Verified Supplier

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250W RGBW LED Light Engine , LOGO Projection Multichip LED Module

... 2, The latest Eutectic Flip-chip bonding with Cree Chips, Thermoelectric solution, fast heat-conductivity between LEDs and MCPCB substrate 3, Unique Parallel and Serial connection of LED design, Lower ......

GUANGZHOU TIANXIN PHOTOELECTRIC CO., LTD
Guangdong,China

Site Member

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BGA PCB Printed Circuit Board Assemblies Custom Circuit Board Design

BGA PCB Printed Circuit Board Assemblies Custom Circuit Board Design Capabilities Include: - SMT - PTH Auto Insertion - BGA - Flip Chip Bonding (Chip on Board) - Manual Insertion - Wire Bonding - Complete Produ...

Huaswin Electronics Co.,Limited
China

Active Member

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45W White LED Emitter Small LES High Light Density for Beam Moving-head

...Flip-chip LEDs, Quality assured LED Components for Entertainment Lighting products; Eutectic bonding to make sure the fast conductivity of heat, it's aim to the lumen maintenance; Small Light Emiting surface...

GUANGZHOU TIANXIN PHOTOELECTRIC CO., LTD
Guangdong,China

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6500K - 8500K LED Light Emitter 65° Viewing Angle 20 W White LEDs

... to the lumen maintenance; Small Light Emiting surface(LES) to enhance the light density; Using copper MCPCB to carry the LED chips, the LEDs can be installed directly to...

GUANGZHOU TIANXIN PHOTOELECTRIC CO., LTD
Guangdong,China

Site Member

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300W 42V LED Light Engine

300watt 42V LED Light Engine White 6000K - 8000K CREE Flip-chip LED Features: 1. Excellent Transiting Heat from LED Chip Operating under 7.5A 2. High Luminous Output 3. No UV 4. Light emitting area is small, po...

GUANGZHOU TIANXIN PHOTOELECTRIC CO., LTD
Guangdong,China

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45 W Convex LENs LED Light Engine , 6000K - 8000K 3400lm White LED Emitters

...Flip-chip LEDs, Quality assured LED Components for Entertainment Lighting products; Eutectic bonding to make sure the fast conductivity of heat, it's aim to the lumen maintenance; Small Light Emiting surface...

GUANGZHOU TIANXIN PHOTOELECTRIC CO., LTD
Guangdong,China

Site Member

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Multichip White LED Array 60Watt Small LES 80lm/W 7500K LEDs

... Vertical / Flip-chip LEDs Eutectic bonding to make sure the fast conductivity of heat, it's aim to the lumen maintenance; Small Light Emiting surface(LES) to enhance the light density; Using copper MCPCB to...

GUANGZHOU TIANXIN PHOTOELECTRIC CO., LTD
Guangdong,China

Site Member

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80lm/W LED Light Engine , Copper 60Watt LED Array Modules

... Vertical / Flip-chip LEDs Eutectic bonding to make sure the fast conductivity of heat, it's aim to the lumen maintenance; Small Light Emiting surface(LES) to enhance the light density; Using copper MCPCB to...

GUANGZHOU TIANXIN PHOTOELECTRIC CO., LTD
Guangdong,China

Site Member

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Multichip White LED Module 60W 7500K Logo Projection 80lm/W LED Arrays

...Vertical / Flip-chip LEDs Eutectic bonding to make sure the fast conductivity of heat, it's aim to the lumen maintenance; Small Light Emiting surface(LES) to enhance the light density; Using copper MCPCB to ...

GUANGZHOU TIANXIN PHOTOELECTRIC CO., LTD
Guangdong,China

Site Member

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