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Fr4 Epoxy Substrate

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Total 1057 products for fr4 epoxy substrate Manufacture & Suppliers

HASL FR4 Printed Circuit Board , 1.6mm Multilayer Metal Core PCB

...Rigid-flexible Board, Flexible Board, High Frequency Board, HDI PCB board, Aluminum Substrate . Haina lean Electronics is a one-stop EMS supplier integrating PCB design, PCB manufacturing, Component sourcing...

Beijing Haina Lean Technology Co., Ltd
Beijing,China

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Customized Processing of 3240 Epoxy Board/Glass Fiber Board/Anti-static Heat-resistant Insulating Board/Lightweight Anti-static Epoxy Board

Customized Processing of 3240 Epoxy Board/Glass Fiber Board/Anti-static Heat-resistant Insulating Board/Lightweight Anti-static Epoxy Board Product Overview Our FR4 epoxy boards (0.5mm fiberglass sheets) and ph...

Guangdong XWELL New Energy Technology CO., LTD.
China

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6L 2OZ Multilayer Printed Circuit Board , FR4 TG150 6 Layers Pcb Green Solder Mask

... have a thickness of 2oz. The thicker copper layers provide better heat dissipation, which makes such PCBs suitable for high-current applications. FR4 TG150 is a type of substrate material commonly used in t...

ShenZhen Jieteng Circuit Co., Ltd.
China

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No Copper 1.5mm FR4 PCB Board With Drill Holes

PCB Spacer FR-4 Spacer Block Space Bar On 1.5mm FR4 with Drill Holes only 1.1 General description This is a type of no copper PCB built on FR-4 Tg135 substrate for the application of spacer. It's 1.57 mm thick ...

Bicheng Electronics Technology Co., Ltd
Guangdong,China

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10pcbs 5.0mm Thick PCB Cutting Machine for FR4 Circuit Board Depanelizer

... of board . 10pcbs in one panel ,19 pieces blade can cut without any problem. Aplication : LED panel , fiberboard , aluminum plate , aluminum substrate , copper substrate , fr4 ,...

Shenzhen SMTfly Electronic Equipment Manufactory Limited
Chongqing,China

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Microelectronics IC substrate manufacture

...substrate.IC package,IC assembly,TF card,MrcroSD card;IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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Flash/NAND memory package substrate production

...substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished th...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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MiniLED substrate manufacture supporting

...substrate for Mini LED/Micro LED Application:MiniLED/Mirco LED Line space/width:1mil (25um) Spec.of pcb production: FR4/BT (0.1-1.0mm) finished thickness; Surface finished:immersion gold/silver/OSP; Copper:1...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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0.2mm Thickness semiconductor assembly substrate microelectronics packaging substrate

... brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold,support ......

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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HOREXS semiconductor ic package substrate With Chip Wire Bonding

...,Nand/Flash memory spackage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.29mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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4L build up types 0.8mm Gold Surface IC Package Substrate

...,Nand/Flash memory spackage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.29mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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Sensors package substrate CMOS substrate manufacture supporting

... thickness:0.25mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold,support ......

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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Horexs Ultra thin MEMS package substrate manufacture supporting

...,IC substrate,acoustics electronics,pressure electronics ,others; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:BT (0.1-0.4mm) finished thickness; Material brand:Mainly b...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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Sip package substrate BT material 4 layer ENEPIG

...,IC package,IC substrate,wearable electronics,IC assembly,Storage IC substrage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.22mm; Material brand:Mainly brand:SHENGYI,...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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Semiconductor Package Substrate 12um copper buildup types

... thickness:0.22mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold,support ......

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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CSP BGA Semiconductor Packaging Substrate 4 Layer BT ENEPIG Surface Finished

... thickness:0.22mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold,support ......

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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0.26mm BT BGA IC Substrate Board manufacture

... thickness:0.26mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold,support ......

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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BT Memory Card BGA package Substrate 6 layer Immersion Gold

... thickness:0.22mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold,support ......

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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25um BT IC Package Substrate Soft gold plating

... thickness:0.22mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion gold,support ......

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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Camera / Bluetooth / Wireless Module Substrate BT 4L 0.21mm Soft Gold Finished

...substrate manufacture Application:Semiconductor package,Wireless modules,Power AMS module,Bluetooth module,Camera module,IC package,WIFI module/Bluetooth module,Others; Spec.of Substrate production: Mini.Lin...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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