| Sign In | Join Free | My burrillandco.com |
|
...substrate ,IC assembly substrate;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate production: Mini.Line space/width:1mil (25...
....Line space/width:1mil (25um) Finished thickness:0.18mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly ...
...substrate package,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package;IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate pro...
... electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.18mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,A...
...substrate manufacture with lower cost China Application:Memory package,Memory packaging substrate,Dram/LPDDR package substrate,Semiconductor package; Spec.of pcb production: Mini.Line space/width:1mil (25um)...
35 m 2 Layers Copper FR4 PCB Board for Industrial Computer Motherboard The FR4 PCB Board is double-sided with 1.6mm substrate thickness. The specification of 2 layers FR4 PCB Board is 510*142.5 mm, whcih is ap...
Fine Pitch Micro Pcb Board with none misregistration SR Application:LED display,LED displays,Lighting pcb,outdoor Led; Spec.of pcb production: Mini.Line space/width:1mil (25um) Finished thickness:BT/FR4 (0.1-0....
... electrical insulation properties along with good mechanical strength and heat resistance. It is made of fiberglass reinforced epoxy laminate which is highly reliable and cost-effective. This board has 6 lay...
UV Resistant Epoxy Polyester Powder Coating , Grey Micro Wrinkle Powder Coat Product Description SUBSTRATES AND PRE-TREATMENT Applied to the following substrates after the appropriate cleaning and conversion co...
UV Resistant Epoxy Polyester Powder Coating , Grey Micro Wrinkle Texture Powder Coat Product Description SUBSTRATES AND PRE-TREATMENT Applied to the following substrates after the appropriate cleaning and conve...
...FR4 substrate SSD NVME 2280 PCIE 128GB 8 Layer Printed Circuit Board PCB Specifications: Part NO: SSDPCB00012 Layer Count: 8 Layer Printed Circuit Board Finished Board Thickness: 0.9mm +/-0.05mm Copper Thick...
...FR4 substrate SSD NVME 2280 PCIE 128GB 8 Layer Printed Circuit Board PCB Specifications: Part NO: SSDPCB00012 Layer Count: 8 Layer Printed Circuit Board Finished Board Thickness: 0.9mm +/-0.05mm Copper Thick...
... responsive temperature sensor that has been dipped in epoxy resin * Temperature sensor designs according to device of fire alarm * Chip from Shibaura NTC thermistor * Epoxy-coated so it can resist humidity ...
...Fr4 Pcb , 1.6mm Tg170 Printed Circuit Board Pcb specification: layer: multilayer material: fr4 Tg value: tg135-tg180 board thickness:1.6mm copper thickness:.1.5oz surface treatment:ENIG Quick detail: Origin:...
...Fr4 Pcb Board Green Soldermask specification: layer: multilayer material: fr4 Tg value: tg135-tg180 board thickness:0.8mm copper thickness:.1.5oz surface treatment:ENIG Quick detail: Origin:China Special: FR...
... PCBs and is fire-resistant. Therefore, these fiberglass epoxy laminated sheets are in great demand in PCB assembly. At FASTPCBA, we manufacture and deliver thousands of PCBs. We use high-quality materials w...
... laminated PCBs and is fire-resistant. Therefore, these fiberglass epoxy laminated sheets are in great demand in PCB assembly. At FASTPCBA, we manufacture and deliver thousands of PCBs. We use high-quality m...
... laminated PCBs and is fire-resistant. Therefore, these fiberglass epoxy laminated sheets are in great demand in PCB assembly. At FASTPCBA, we manufacture and deliver thousands of PCBs. We use high-quality m...
...substrate;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate production: Min...
...substrate,IC packge pcb,IC/chip assembly,Memory card,TF card,UDP,SD card;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronic...