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Soft and compressible for low stress applications 1.5mmT silicone sheets for Mass storage devices The TIF160-40-11US is a silicone based, thermally conductive gap pad. Its unreinforced construction allows addit...
...Gap filler For Notebook The TIF7160L-HM is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibrat...
... of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics.TIF7120HZ is an electrically isolating material, which allows its use in applications requiring isolat...
...Gap Filler Thermal Conductive Silicone Pad Ziitek TIF7100Q is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellen...
... low-stress vibration dampening and shock absorbing characteristics. Ziitek TIF780QE is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and hig...
...Gap Filler Used In Chassis Or Other Heat Dissipation Components The TIF®100-06U Series is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the ...
... of 4.0 W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique filler packag...
Semiconductor automated test equipment (ATE) Thermal Gap Filler For High Speed Mass Storage Drives The TIF100-12E thermally conductive interface materials are applied to fill the air gaps between the heating el...
Semiconductor automated test equipment (ATE) Ziitek Thermal Gap Filler in MB application TIF100-02S The TIF100-02S thermally conductive interface materials are applied to fill the air gaps between the heating e...
...gap filler Company Profile Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advan...
Silicone-free 3W China manufacturer thermal gap pad –20 To 125 ℃ Z-paster140-30-10F for Silicone-sensitive applications Company Profile Ziitek company is a manufacturer of thermal conductive gap fillers, low me...
... thermal gap pad for Micro heat pipe thermal solutions,-40 to 160℃ The TIF1100-30-11US is an extremely soft gap filling material rated at a thermal conductivity of 3 W/m-K. It is specially formulated for hig...
... conductive gap pad 20±5 Shore 00,3.0 W/m-K for mainboard/mother board The TIF1160-30-11US is an extremely soft gap filling material rated at a thermal conductivity of 3.0 W/m-K. It is specially formulated f...
Viscoelastic Thermal Gap Pad, 3.0mmT, 2.5g/Cc, 18 Shore 00 For LED Power Supply UL Recognized 1.5mmT Thermal Gap Pad, 2.5g/cc, 18 Shore 00 for Audio Video Components The TIF1120-18-01US is recommended for appli...
...gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin des...
...gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin des...
...gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin des...
... Led Panel Light Thermal Gap Filler For LED Lamp The TIF7140L-HM is an extremely soft gap filling material rated at a thermal conductivity of TIF7140L-HM W/m-K. It is specially formulated for high performanc...
Wholesale Customized thermal gap pad for Laptop Led CPU GPU Ziitek TIF7140HP is an extremely soft gap filling material rated at a thermal conductivity of 7.5 W/m-K. It is specially formulated for high performan...
... It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra lo...