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Handheld Portable Electronics Thermal Gap Filler with Adhesive Ceramic Filled Silicone Rubber The TIF160-40-10S is recommended for applications that require a minimum amount of pressure on components. The visco...
...Electronics Cooling The TIF160-20-19F is an extremely soft gap filling material rated at a thermal conductivity of 2.0W/m-K. It is specially formulated for high performance applications requiring low assembl...
Heat Sinking Housing Conductive Garnet Thermal Gap Filler 6.0 W/MK UL / RoHs silicone rubber pad 45shore00 The TIF600GP is an electrically isolating material, which allows its use in applications requiring isol...
... and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications. The TIF100-20-07E is no...
Thermal Gap Filler in Semiconductor automated test equipment (ATE) Applications: > Cooling components to the chassis of frame > High speed mass storage drives > Heat Sinking Housing at LED-lit BLU in ......
...Socket Cam Follower Roller Bearing With Gap Seals 10x22x36mm Stock QTY : 165.pcs (More on the way) Bearing Model KR22-PP Type Hexagonal Socket Cam Follower Structure Cam Follower Roller Bearing With Gap Seal...
ultra soft Soft and compressible for low stress applications for thermal conductive gap filler,5.0mmT,20±5 shore00 The TIF1200-12-05US use a special process, with silicone as the base material, adding thermal ....
...Socket Cam Follower Roller Bearing With Gap Seals 10x22x36mm Stock QTY : 165.pcs (More on the way) Bearing Model KR22-PP Type Hexagonal Socket Cam Follower Structure Cam Follower Roller Bearing With Gap Seal...
2.0 W/mK Soft and Compressible for Low Stress Applications Silicone Pads for LED Controller The TIF120-20-10UF is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional ...
3.0mmT Soft and Compressible for Low Stress Applications Conductive Pads for CD-Rom The TIF1120-20-10UF is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional complia...
4.0 W/mK Soft and Compressible for Low Stress Applications Tthermal Pad for Mainboard The TIF120N-40-10F is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compli...
1.5W/M.K Cooling Gap Filler Insulation Silicone Rubber High Conductive Thermal Pad For Semiconductor Heat Dissipation The TIF100-10S Series is recommended for applications that require a minimum amount of pres...
...1.0 W/m·K, very low oil bleed (<0.01% at 150°C/24 hrs), and high volume resistivity (2.89 x 10¹⁵ Ω·cm). This grease is designed for gap-filling applications and offers a shelf life of 12 months at 25°C. Product Introduction DOWSIL™ CN-8880 is a...
High Thermally Conductive Filler Pads TIF840QE LED Light Application 1mm Thickness The TIF840QE thermally conductive interface materials are applied to fill the air gaps between the heating elements and the hea...
-40 to 160 low cost insulation silicone pad for LED Ceilinglamp,20 Shore 00 The TIF180-32-05US is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature o...
4.5mmT Hardness 20 shore 00 High durability silicone pads for Monitoring the Power Box The TIF1180-32-05US is recommended for applications that require a minimum amount of pressure on components. The viscoelast...
Fire rating 94 V0 popular professional silicone pads for Rainproof LED Power,20 shore 00 The TIF180-30-02US is recommended for applications that require a minimum amount of pressure on components. The viscoelas...
1.0mmT High tack surface reduces contact resistance silicone pads for GPS navigation The TIF140-30-06UF is recommended for applications that require a minimum amount of pressure on components. The viscoelastic ...
2.5mmt Low Cost and High Durability Thermal Pad for Power Supply The TIF1100-30-06UF is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the mater...
Specific Gravity 3.0 g/cc Heat Sink pad Moldability for Complex Parts for Memory Modules The TIF1200-30-06UF is recommended for applications that require a minimum amount of pressure on components. The viscoela...