| Sign In | Join Free | My burrillandco.com |
|
... for extreme heat dissipation requirements in power-dense electronic systems. With a thermal conductivity rating of ≥2.0 W/m·K, low water absorption, and UL94 V0 flame retardancy, it provides exceptional the...
... the gaps between heat-generating components and liquid cooling plates or metal bases.lts flexibility and elasticity make it ideal for covering highly uneven surfaces.With excellent thermal conductivity, it ...
High Thermal Conductive Two Component Potting Silicone For LED And Power Drive Potting Products description TIG®680-15AB is a two-part silicone potting adhesive with high thermal conductivity, room temperature ...
...High Thermal Conductive Silicon Pad For Graphics Card Ziitek Technology Company is dedicated to providing a comprehensive range of thermal management products and services to meet various demand scenarios. Z...
...High Thermal Conductivity Graphite Sheet Meets EU Environmental Standards The TIR™600 Series products are high-performance and heat-conductive interface materials with the reasonable prices.They can be used ...
...High Thermal Conductive Flexible Graphite Sheet For Smart Phone TIR™600 Series products are high-performance and heat-conductive interface materials with the reasonable prices.They can be used in application...
High Thermal Conductive 13W Silicone Thermal Sheet Thermal Pad For Automotive Efficient Heat Dissipation Product descriptions TlF800Q is a silicone based, thermally conductive gap pad. Its unreinforced construc...
...High Thermal Conductivity Die Cut Silicon Thermal Pad For AI Processors AI Servers The TIF®700PU Series is a thermal pad specifically designed to tackle the high level cooling challenges and environments sen...
...High-Power Electronics Thermally Conductive Compound Simple attributes Dowsil TC-5860 is a one-part, gray, non-curing grease-like thermally conductive compound. It features high thermal conductivity, high d...
...High Thermal Conductivity GPU CPU Thermal Gap Pads Thermal pads are a type of thermal interface material (TIM) that are used to improve the heat transfer between a heat source and a heat sink. They are typic...
...High Thermal Conductivity COB LED for High Power Stage Lighting and Projector Spotlights Product Overview This 300W COB LED uses a large 45×45mm package and a high-thermal-conductivity copper-core ceramic su...
...High Thermal Conductivity Die Cut Silicon Thermal Pad For AI Processors AI Servers Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal in...
High Thermally Conductive 15W/MK Gray Thermally Gap Pads For 5G Base Stations Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface ...
High Thermal Conductivity 6.5W/MK Thermal GAP PAD Materials For Computer CPU/GPU Cooling Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal...
High Performance CPU GPU Laptop Silicone High Thermal Conductivity Pad Factory Company Profile Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufactur...
High Thermal Conductivity Resistant Flame-Retardant Insulation 7.5W/MK Silicone Thermal Pad Product descriptions TlF®500-75-11U Series is a silicone based, thermally conductive gap pad. Its unreinforced constru...
...high thermal conductivity COS series device package Diamond copper composite material is composed of diamond and copper. It has the characteristics of high thermal conductivity and matching coefficient of th...
TIF100-20-05S blue High Thermal Conductive Pad For CPU Heat Dissipation 2.95 g / cc Specific Gravity 2.0W/mK The TIF100-20-05S thermally conductive interface materials are applied to fill the air gaps between ...
High Voltage Isolation Heatsink Thermal Pads Non Toxic 4W / mK For Micro Heat Pipe The TIF100-11U Series thermally conductive interface materials are applied to fill the air gaps between the heating elements an...
CPU Heat Dissipation TIF100-30-05S blue High Thermal Conductive Pad 3.0 g / cc Specific Gravity 3.0W/mK The TIF100-30-05S thermally conductive interface materials are applied to fill the air gaps between the he...