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...Bonding Wire with 0.01mm Diameter Optimal for Delicate Electronic Assemblies Winner offers a wide selection of ball, wedge and stud bonding wires in a varied portfolio of 5N 99.999 / 4N 99.99 / 3N 99.9 / 2N ...
High Resolution Optical Bonding LCD 10.1 Inch Atmel Chip Fog Resistance Anti - Radiation Ordinary adhesive bonding: Use double sided adhesive to bond LCD and touch panel. Optical bonding technology: Use optical...
High Resolution Optical Bonding LCD 10.1 Inch Atmel Chip Fog Resistance Anti - Radiation Ordinary adhesive bonding: Use double sided adhesive to bond LCD and touch panel. Optical bonding technology: Use optical...
High Resolution Optical Bonding LCD 10.1 Inch Atmel Chip Fog Resistance Anti - Radiation Ordinary adhesive bonding: Use double sided adhesive to bond LCD and touch panel. Optical bonding technology: Use optical...
Cof IC Bonding Machine 610dh LCD Bonding Machine for LED LCD TV Flex Cable Repair Tab Cof Bonding Machine Product Description Single Head Bonding Machine is designed for LCD/LED TV repair, which can solve the p...
High Resolution Optical Bonding LCD 10.1 Inch Atmel Chip Fog Resistance Anti - Radiation Ordinary adhesive bonding: Use double sided adhesive to bond LCD and touch panel. Optical bonding technology: Use optical...
High Resolution Optical Bonding LCD 10.1 Inch Atmel Chip Fog Resistance Anti - Radiation Ordinary adhesive bonding: Use double sided adhesive to bond LCD and touch panel. Optical bonding technology: Use optical...
High Resolution Optical Bonding LCD 10.1 Inch Atmel Chip Fog Resistance Anti - Radiation Ordinary adhesive bonding: Use double sided adhesive to bond LCD and touch panel. Optical bonding technology: Use optical...
...Bonding Adhesive BA-213 (Equivalent to Chemlok 205,Chemosil 211,Cilbond 10E/12E) 1. Description Our BA-213 is a heat vulcanization bonding agent for rubber and various metals. It works as general purpose pri...
...Bond Dicing Blades Product overview Resin bond dicing blades without steel core is mainly used for precision cutting and slotting for semiconductor, optical glass, quartz glass,ceramics and so on. Main featu...
... sheets, medium and heavy plates, continuous casting and rolling, and non-ferrous metal plate processing rolls Product features: high grinding ratio, prolonging the service life of the...
High Precision Multilayer Capability Quick Changeover IC Bonding Machine WBD2200 The IC bonder is used for multi-chip placement, with mature technology application platform, which offers higher accuracy with ne...
...Bonding Wire for Precision IC & Semiconductor Packaging Our high-purity gold bonding wire is specially engineered for inner lead packaging in advanced integrated circuits (ICs) and semiconductor sepa...
.... Known for its superior magnetic performance and structural integrity, the Bonded Neodymium Magnet combines the powerful magnetic properties of neodymium with the flexibility of bonding techniques, resultin...
...) minimum Yield Strength: 240 MPa (35,000 psi) minimum Elongation: ≥ 21% Carbon Content: 0.30% max Operating Temperature Range: -29°C to 425°C (-20°F to 800°F) Weld Strength: HFW creates a metallurgical bond...
...adhesive on PET surface. It has good adhesion. Features And Benefits: 1. Strong PET film base with high adhesive strength. 2. Excellent tensile strength & Elongation. 3. RoHS standard. Properties: Item Typic...
...High Stability Of The Turret Roll Molding Machine Custom attribute product name Turret type plastic rolling machine property High stability Material metal Working ability Continuous production model custom m...
... are incorporated. 6N high-purity aluminum is highly sought after for its remarkable purity, reaching 99.9999%. This level of purity is crucial in applications where even minute impurities can have a signifi...
...Bonding Wire High Purity and Versatility for Automotive and Computing Equipment * It is widely used in packaging various power semiconductors. In power electronics, MOSFET used in power supply and motor cont...
...Bonding Wire Made from 6N High Purity Material with Trace Elements Essential for Power Semiconductor Encapsulation * Used in packaging various power semiconductors. In power electronics, MOSFET used in power...