| Sign In | Join Free | My burrillandco.com |
|
... power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of lubricating grease and ...
... and other power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of lubricating g...
...Thermal Conductive Acrylic Tape for LED strip The TIA™800FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesiv...
...Thermal Conductive Adhesive For Led Fluorescent Lamp The TIA™800FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of ...
...Thermally Adhesive Tape For LED Mount Heat Sink Conductive tape 0.9 W/MK The TIA™810FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semicondu...
...Thermal Adhesive Tape 1.2 W/mK For Led Fluorescent Lamp 0.1~0.5mmT The TIA™800FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors....
...Thermal Adhesive Tape For LED Mount Heat Sink with 0.8 W/mK double adhesive The TIA™820FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semico...
... and other power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of lubricating g...
...thermal adhesive double side tape fire resistance equate 94 V-0 The TIA™605P Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. Th...
Thermal conductive adhesive fire resistance tape TIA608P 0.2mm thickness for bonding heat microprocessors The TIA608P Series products are mostly used for bonding heat dissipation fins, microprocessors and other...
...fins, microprocessors and other power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the me...
...Thermal Shock Chamber is ideally designed for testing most commercial products to see how they withstand drastic temperature changes, a harsh condition that subject a product to the most extreme temperature ...
...Thermal Shock Chamber is ideally designed for testing most commercial products to see how they withstand drastic temperature changes, a harsh condition that subject a product to the most extreme temperature ...
...ensure low error and low noise operation.The two-box method has the advantages of shortening the temperature recovery time, shortening the test time, and having the normal temperature recovery function. It c...
... extreme temperature conditions, instantly.Some times with liquid nitrogen cooling if request more strictly temperature. Thermal shock test is used as a vital method to quality inspection for all types of el...
Name: Thermal printing with cd driver / portable bluetooth/usb printer - MP-385 80mm Model: MP-385 Specifications Interfaces USB & COM & Bluetooth 4.0 Print Comand TSPL command (ESC/POS command) Print Method Th...
...Method Thermal Line Printing Speed 300mm/s Effective Printing Width 72mm Resolution 8 dots/mm, 576 dots/line Print Font Font A: 12*24 dots Font B: 9*17 dots Simplify/Traditional:24*24 dots Language English/F...
... For Automotive Parts is divided into two-box and three-box type, the difference is that the test method and internal structure are different, the product conforms to the standard: GB/T2423.1-2008 test A, GB...
Thermal Imaging Dual-spectral Camera Network Intelligent Dome IP Camera with Tracking Smart function ( thermal imaging ) : Smart tracking: a variety of tracking methods such as panoramic tracking and event trac...
...*960mm 2,400dpi Plate Size Max.1160*960mm Exposing Size Max.1130*940 Media Type Positive Thermal plate, Positive UV plate Plate Thickness 0.15mm-0.3mm Resolutions 2,400dpi Repeatablity ±5μm(Continuous exposu...