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Application:Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0...
Application:Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0...
... Program ic Chip Memory IC PESD5V0S2BT Low capacitance bi-directional double ESD protection diode in SOT23 package 1.1 General description Low capacitance bi-directional double ESD protection diode in the sm...
... services ensure your IC chips arrive on time and in the best condition possible. We are committed to providing the highest quality IC chip design and production services at competitive prices. Integrated Ci...
.... It features a low-voltage CMOS compatible logic input, a wide operating voltage range and an extremely low operating current. The IC is designed to drive N-channel MOSFETs up to 200V and...
... system, providing the necessary functionality and interconnection between other components. The ICs are designed to be small, robust and reliable, and are available in a variety of form factors and packages...
.... It is available in a small, easy-to-use 8-pin SOIC package. Features: • Low Noise: 6.5 nV/√Hz • High Output Slew Rate: 2.1 V/µs • Wide Dynamic Range (A-Weighted): 120 dB • ......
...Flat Handling Surface for Accurate Placement • Package Design for Top Slide or Bottom Circuit Board Mounting • Low Profile Package • Ideal Replacement for MELF Packages • Pb−Free Packages are Available Mecha...
NV6046C GaN IC eMode GaN FET IC 650V GaNFast™ Power FET IC DPAK-2L High-performance 650V enhancement-mode GaN FET IC with GaNFast™ technology in DPAK-2L package, designed for efficient power conversion applicat...
...IC chip designed for use in a variety of applications. Features: • High-speed differential receiver • Low-skew, low-jitter clock receiver • Low-power consumption • Supports data rates up to 5.2 Gbps • Operat...
...plastic package designed to protect two automotive Controller Area Network (CAN) bus lines from the damage caused by ElectroStatic Discharge (ESD) and other transients. 1.2 Features ■ Due to the integrated d...
...IC Power Chip Develop PCBA Solution Our service scope covers various customized chips, including analog chips, digital chips, mixed signal chips, etc. We also offer various packaging methods to meet the diff...
... buck switching regulator ICs with multiple voltage and temperature options. This electronic component IC chip is available in a variety of packages including DIP, SOP, QFP, QFN, and BGA. It is designed to s...
...IC with High Voltage Protection Product Listing: LTV-217-TP1-B-G Power Isolator IC Description: This Power Isolator IC is designed to provide isolation between AC and DC circuits . It features high voltage i...
... Circuits ICs product is essential for various electronic applications requiring reliable data transfer. With an impressive operating temperature range of -40°C to 85°C, the CP2102-GMR IC is suitable for use...
NV6144CP01 GaN IC High Performance N-Channel 700V 260mΩ GaNSlim Power IC High-performance N-Channel GaN power IC featuring 700V voltage rating and 260mΩ on-resistance in compact GaNSlim package design. MJD Adva...
...IC 6.2V To 24V 210mΩ GaNSlim™ Power IC In DPAK-4 Package High-performance GaN power IC featuring GaNSlim™ technology with wide operating voltage range and low on-resistance in compact DPAK-4 package. Key Spe...
... Audio SoC in a BGA package, designed for use in compact, voice-enabled, feature-rich truly wireless earbuds. QCC-5144-0-CSP90B-TR-01-0 is optimized for use in earbuds and hearables, this premium tier single...
...IC Chip Differential Bus Transceiver Interface IC Package SOIC-8 SN75ALS176BDR Series: SN75ALS176B Mounting Style: SMD/SMT Package / Case: SOIC-8 Function: Transceiver Number of Drivers: 1 Driver Number of R...
... circuit (IC) chip designed for use in a wide range of applications. It is a high-performance, low-power, and cost-effective solution for computing, communication, and multimedia applications. It features a ...