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Ic Packaging Process

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Total 79290 products for ic packaging process Manufacture & Suppliers

AUS308 PSR IC Package substrate manufacture

Application:UDP memory card,TF card,Memory card,SD card ,IC substrate pcb board;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrat...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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EMMC IC Package Substrate PCB BGA Gold Plating 0.2mm Finished FR4 Material

...UAV,house electronics,consumer electronics. Product description IC substrate is a type of carry material for integrated circuit with internal circuit to connect the chips and PCBS. Additionally, the IC subst...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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Injection JEDEC Tray With Custom Cavity Design For IC Packaging And Shipping

Injection JEDEC Tray With Custom Cavity Design For IC Packaging And Shipping Need packaging that integrates into your existing process? Our JEDEC trays are automation-ready and tailor-made for your workflow. Th...

Shenzhen Hiner Technology Co., Ltd.
Guangdong,China

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HOREXS semiconductor ic package substrate With Chip Wire Bonding

Application:Memory card,UDP,bonding PCB printed circuit boards;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash ...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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25um BT IC Package Substrate Soft gold plating

Application:Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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Hitachi BT IC Package Substrate 0.29mm 4 Layer 0.5oz Copper Custom

..., special line, it is designed for heat dissipation and acts standardized module of IC components. It is one of the most key materials of the IC packaging, and the share of IC substrate. Application: Dram me...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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Anti-Static And Automation Ready Custom JEDEC Tray For IC Packaging

.... This JEDEC-compliant matrix tray provides a practical and robust solution for organizing electronic components throughout automated assembly, inspection, and shipping processes. The tray is engineered to u...

Shenzhen Hiner Technology Co., Ltd.
Guangdong,China

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Stainless Steel Turnkey Mixing And Packaging Processing Line 5T/D 380V

High quality turn key fruit paste packaging processing line 5T/D Description The Paste/ Jam/ Sauce/ Puree mixing production line is mainly composed of Empty Bottle Unscrambler, Bottle ......

Shanghai Gofun Machinery Co., Ltd.
Shanghai,China

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Industrial Automatic Mixing And Packaging Processing Line ISO 9001 Approved

High efficiency tomato juice/ paste mixing and packaging processing line silver color Description The Paste/ Jam/ Sauce/ Puree mixing production line is mainly composed of high-speed sugar-dissolving equipment,...

Shanghai Gofun Machinery Co., Ltd.
Shanghai,China

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2 Layers IC Package Substrate Palladium Gold COF Electric Annoyed Liquid Crystal Drive

2 layers of COF,electric annoyed liquid crystal drive,IC Package Substrate,palladium gold,ic package,pcb production Product Description Product area: electric annoyed liquid crystal drive Number of layers: 2 la...

Shenzhen Chaosheng Electronic Technology Co.,Ltd
Hong Kong,China

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IC Packaging Customized Outline JEDEC Matrix Trays ESD 7.62mm Flatness

...IC Packaging ESD 7.62mm Flatness Our company will select JEDEC outline matrix trays for your IC and ensure compatibility with standardized semiconductor automation processes, test equipment and process tools...

Shenzhen Hiner Technology Co., Ltd.
Guangdong,China

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Environmentally Sustainable Packaging Plastic Pet Strap Polyester Pet Band Strap For Both Manual And Automated Packaging Processes

...) Material: Polyethylene Terephthalate 100% Fresh Raw Material or as per customer request Surface Type: Embossed / Smooth Plain Production Process: Extrusion Product Width: 9mm - 32mm Thickness: 0.4mm - 1.2m...

SHENZHEN JIATUO PLASTIC MACHINERY CO.,LTD
China

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IC Packaging Parts Inline Cleaning System With Trial Chemical Wash Sections

...IC packaging parts auto cleaning system with trial chemical wash sections. SC830 is a high wash ability FC packaging deflux cleaning system. 810 IC packaging auto cleaing machine is used to clean flux residu...

Dongguan Shenhua Mechanical and Electrical Equipment ...
Guangdong,China

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3x7 Matrix Black MPPO JEDEC Trays For IC Packaging Industry

... range of JEDEC matrix trays to meet our customers' stringent requirements for automated testing and processing environments. Although the JEDEC standard provides various requirements for tray process eq...

Shenzhen Hiner Technology Co., Ltd.
Guangdong,China

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ESD Plastic JEDEC Standard Matrix Tray For IC Packaging

... is the packaging tray used by the enterprise for its chip packaging test. Because the IC chip is small and thin, the enterprise will generally take external protection to avoid scratches and damage. JEDEC M...

Shenzhen Hiner Technology Co., Ltd.
Guangdong,China

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XC7A35T-2CSG325I IC Chip Programming FPGAs Programmable Logic ICs Quickly Processing

...I/O 150 Voltage - Supply 0.95V ~ 1.05V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 324-LFBGA, CSPBGA Supplier Device Package 324-CSPBGA (15x15) Base Product Number XC7...

Shenzhen Sai Collie Technology Co., Ltd.
China

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BGA QFP QFN LGA PGA IC Type JEDEC Trays Surface Resistant Suitable For IC Packaging

BGA QFP QFN LGA PGA IC Type JEDEC Trays Surface Resistant Suitable For IC Packaging Looking for a durable, heat-resistant tray for IC packaging? This JEDEC tray combines quality materials with exacting standard...

Shenzhen Hiner Technology Co., Ltd.
Guangdong,China

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Medical Care Plastic Blister Packaging Processing Large Thick Sheet

...Packaging Processing Large Thick Sheet High-quality medical care plastic blister packaging designed for pharmaceutical and medical applications. Our custom plastic pallets and blister processing solutions of...

Xiamen Xiexinlong Technology Co.,Ltd
Fujian,China

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High Storage Efficiency Lightweight JEDEC Tray with ESD Protection for IC Packaging

...IC Packaging Designed for high-level semiconductor cleanroom environments, this tray minimizes contamination and ensures IC integrity. Key Features/ Benefits Lower cost solution Lightweight design High stora...

Shenzhen Hiner Technology Co., Ltd.
Guangdong,China

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ADP1613ARMZ-R7 Power Management ICs Boost SEPIC Switching Regulator IC Package 8-TSSOP 8-MSOP63

ADP1613ARMZ-R7 Power Management ICs Boost SEPIC Switching Regulator IC Package 8-TSSOP 8-MSOP Product Status Active Function Step-Up Output Configuration Positive Topology Boost, SEPIC Output Type ......

Shenzhen Sai Collie Technology Co., Ltd.
China

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