Home > Electrical Equipment & Supplies > Power Supplies > Voltage Regulators/Stabilizers >

Ic Packaging Process

Fair Trading Service

Report fraud supplier Report IPR Products

Haven't found right suppliers
Our buyer assistants can help you find the most suitable, 100% reliable suppliers from China.
And this service is free of charge.
we have buyer assistants who speak English, French, Spanish......and we are ready to help you anytime!

Submit Buying Request

Total 79257 products for ic packaging process Manufacture & Suppliers

MAX8815AETB+T Power Management ICs Boost Switching Regulator IC Package 10-WFDFN Exposed Pad

MAX8815AETB+T Power Management ICs Boost Switching Regulator IC Package 10-WFDFN Exposed Pad Product Status Active Function Step-Up Output Configuration Positive Topology Boost Output ......

Shenzhen Sai Collie Technology Co., Ltd.
China

Verified Supplier

Add to cart
180°C High Temp JEDEC Tray with ESD Protection for Semiconductor IC Packaging

High Temp ESD JEDEC Tray for AI Chips Packaging This JEDEC tray is specially designed for high temperature semiconductor processes, such as baking, burn-in, and AI chip packaging. It ensures dimensional stabili...

Shenzhen Hiner Technology Co., Ltd.
Guangdong,China

Verified Supplier

Add to cart
Universal JEDEC Matrix Tray Stackable For IC Packaging Industry

Universal JEDEC Matrix Tray Stackable For IC Packaging Industry Offering both standard and custom configurations, our JEDEC trays meet a wide range of semiconductor packaging needs. This JEDEC matrix tray is cr...

Shenzhen Hiner Technology Co., Ltd.
Guangdong,China

Verified Supplier

Add to cart
Silver Alloy Bonding Wire High Purity For IC Packaging And LED Equipment

... purity level reaching no less than 99%. In addition to this, it is supplemented with carefully selected alloy elements. Each of these alloy elements undergoes a meticulous selection process. Scientists and...

SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD.
China

Verified Supplier

Add to cart
SS304 Mixing And Packaging Processing Line Juice Jam Milk And Water Blending And Filling Line

Easy operation SS304 juice jam milk and water blending and filling line Description The Paste/ Jam/ Sauce/ Puree mixing and packaging production line is mainly composed of high-speed sugar-dissolving equipment,...

Shanghai Gofun Machinery Co., Ltd.
Shanghai,China

Verified Supplier

Add to cart
Energy Saving Mixing And Packaging Processing Line Fruit Paste Mixing System

Energy Saving Fruit Paste Mixing System Easy Maintenance Equipment Description The Paste/ Jam/ Sauce/ Puree mixing and packaging production line is mainly composed of high-speed sugar-dissolving equipment, filt...

Shanghai Gofun Machinery Co., Ltd.
Shanghai,China

Verified Supplier

Add to cart
Antistatic Waffle Pack Chip Trays IC Packaging Protecting CSP

..., can effectively avoid short circuit phenomenon.Because the product is prone to friction in the process of placement and transportation, if there is some static electricity on the circuit board of the produ...

Shenzhen Hiner Technology Co., Ltd.
Guangdong,China

Verified Supplier

Add to cart
Socket Type Anti Static IC Packaging Tray High Temperature Resistance

Socket Type Anti Static IC Packaging Tray High Temperature Resistance Specially Customized Socket Type Anti-Static Tray For Electronic Components For electronic products in the process of transportation and pac...

Shenzhen Hiner Technology Co., Ltd.
Guangdong,China

Verified Supplier

Add to cart
Custom Black High Temperature JEDEC Trays For IC Packaging In PPE Raw Material

...IC Packaging In PPE Raw Material Features: Compatibility: The JEDEC trays have been specifically designed and manufactured to fit seamlessly with standard handling and testing equipment. They are readily com...

Shenzhen Hiner Technology Co., Ltd.
Guangdong,China

Verified Supplier

Add to cart
ODM PCB Module ESD Black IC Packaging Trays Heat-Resistant

ODM PCB Module ESD Black IC Packaging Trays Heat-Resistant Go beyond off-the-shelf��get JEDEC trays engineered for your chip��s shape, height, and transportation needs. While the JEDEC Tray is widely used in the ...

Shenzhen Hiner Technology Co., Ltd.
Guangdong,China

Verified Supplier

Add to cart
Communication IC Package Substrate Aluminum Base ENIG Surface Finishing

... line spacing 0.009/0.009mil, nickel palladium Quantities range from prototype to volume production. 100% E-Test Packing: vacuum packaging + desiccant +...

Shenzhen Chaosheng Electronic Technology Co.,Ltd
Hong Kong,China

Active Member

Add to cart
High Heat Dissipation Hermetic Packages Electronics Mo50Cu50 Heat Spreader For IC Packages

High Heat Dissipation Hermetic Packages Electronics Mo50Cu50 Heat Spreader For IC Packages Description: Mo-Cu heat sink material is a composite of molybdenum and copper, its thermal expansion coefficient and th...

Zhuzhou Jiabang Refractory Metal Co., Ltd
Hunan,China

Verified Supplier

Add to cart
BT semiconductor IC packaging substrate manufacture

... card,Flash memory card,DDR,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;IC package,Semiconductor package,Memory electronics,NAND/Flas...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

Verified Supplier

Add to cart
High Temperature Standard JEDEC Tray IC Packaging

...provide a visual indicator of the Pin 1 orientation of the IC and prevent the stack of errors, reduce the possibility of workers making mistakes, and maximize the protection of the chip. Providing a variety ...

Shenzhen Hiner Technology Co., Ltd.
Guangdong,China

Verified Supplier

Add to cart
CMOS sensors ic package manufacture supporting

Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,telecommunication electronics,consumer electronics,Storage IC substrage;IC package,Semiconductor package,Memory electronics,NAND/Fl...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

Verified Supplier

Add to cart
Custom Silver Bonding Wire With Composite Material Treatment For IC Packaging

...game - changer in the field of high - reliability IC packaging. Made of high - purity silver, this bonding wire offers excellent electrical conductivity, ensuring efficient signal transmission in ICs. The co...

SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD.
China

Verified Supplier

Add to cart
ENIG Wire/die Bond BGA package Substrate IC Packaging Substrate fabrication

Application:IC substrate package,Wifi module/Bluetooth module,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Sp...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

Verified Supplier

Add to cart
BGA IC Packaging Black JEDEC Matrix Trays ESD Stable Surface

BGA IC Packaging Black JEDEC Matrix Trays ESD Stable Surface BGA IC Packaging Solution ESD Stable Surface Resistance Matrix Tray JEDEC Tray/Matrix Tray/IC Tray/ESD Packing Tray Antistatic trays are among those ...

Shenzhen Hiner Technology Co., Ltd.
Guangdong,China

Verified Supplier

Add to cart
Semiconductor Machine Molding Mould For IC Molding Process Rustproof

... in perfect condition. Here's a breakdown of our packaging and shipping process: Packaging Each Trimming Forming Die is carefully placed in a sturdy cardboard box, surrounded by protective padding to prevent...

Guangdong Taijin Semiconductor Technology Co., Ltd
Guangdong,China

Active Member

Add to cart