| Sign In | Join Free | My burrillandco.com |
|
Pink/White Outstanding Thermal Performance Thermal Pad for RDRAM Memory Modules Company Profile With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materi...
Lumbar Support Pillow Memory Foam Back Cushion Chair Back Pillow Product Description: Backrest pillow provides a comfortable cloud of back support; fits any chair or seat, even in oddly shaped chairs, wheelchai...
...Memory Modules The TIF120-02S Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility a...
... Heat Pipes Direct Touch GPU Video Card Graphics Processing: GeForce® RTX 2060 SUPER™ Core Clock: 1815 MHz (Reference card: 1650 MHz) RTX-OPS: 45 CUDA® Cores: 2176 Memory Clock: 14000 MHz Memory Size: 8 GB M...
... Memory Module with Heatsink Supports Intel Coffee Lake Processors and Intel Extreme Memory Profile (Intel XMP) Standards. Aluminum heat sink and low voltage of 1.35V enable fast heat dissipation and lower h...
... Heat Pipes Direct Touch GPU Video Card Graphics Processing: GeForce® RTX 2060 SUPER™ Core Clock: 1815 MHz (Reference card: 1650 MHz) RTX-OPS: 45 CUDA® Cores: 2176 Memory Clock: 14000 MHz Memory Size: 8 GB M...
...Memory Alloy SMA Nitinol with Shape Memory and Superelasticity Nitinol combines two closely related unique characteristics: shape memory and superelasticity. Shape memory gives Nitinol the ability to be defo...
... the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to ...
...Memory Modules 2W thermal conductive gap filler 35 shore00 TIF130-20-11E The TIF130-20-11E Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and th...
...Memory Modules The TIF100-14E Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility ...
..., complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a hi...
...pad 20 Shore00 for RDRAM memory modules ,Good thermal conductive:1.8W / MK The TIF540-18-11US is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between...
...Electrically Isolating Conductive Pads for RDRAM Memory Modules The TIF2200-20-02ES is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating a...
...Memory Modules TIF®100C 10075-11 series is a silicone-based thermal material designed to fill the gaps between heat-generating components and liquid cooling plates or metal bases. lts flexibility and elastic...
Odorless Super Clear 40mic PVC Shrink Films - Blown For Shrink Label 1. Description PVC Shrink Films-Blown - A type of shrink wrap used for a variety of applications. The PVC stands for Polyvinyl chloride. It i...
...different from other alloys due to its remarkable shape memory characteristics. It has the ability to return to its original shape after it has been deformed, simply by heating it above its shape memory temp...