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...Factory Customizable 7.5W/MK Thermal Pads For Memory Modules The TIF™700P Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipat...
... too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. TIS™800K Series is a high performance insulator.It combines MT Kapt...
Gray Compressible Thermally Conductive Heat Sink Cooling Pad For Memory Modules With professional R&D capabilities and over 19 year experiences in thermal interface material industry, Ziitek company own many un...
... applications. Designed without cooling fans the rugged extruded aluminum chassis acts as a heat sink to dissipate internal heat and provide quiet noise free operation. A breakthrough in micro computing than...
...memory modules Company Profile Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus the...
4.0mmT RoHS compliant , ultra soft heat sink pad 20 SHORE00 For Memory Modules 1.8W/m-K The TIF5160-18-11US is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional com...
... product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. TIF100-01ES-Series-Datasheet.pdf TIF120-01E...
...flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink. TIF100-30-11ES-Datasheet-REV02....
... which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. TIF100-40-11US-Series-Datasheet.pdf TIF1120-40-11US...
...Memory Modules The TIF140-30-02US use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface mate...
...Memory Modules The TIF160-01US use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface materia...
Specific Gravity 3.0 g/cc Heat Sink pad Moldability for Complex Parts for Memory Modules The TIF1200-30-06UF is recommended for applications that require a minimum amount of pressure on components. The viscoela...
Moldability for complex parts Heat Sink Pad for Memory Modules, Continuos Use Temp -40 to 160 The TIF1140-10UF thermal silicone pad is a product with both performance and economy. It is a unique thermal pad wi...
...memory saving function Sealing Size 400*10 x2mm 500*10 x2mm 600*10 x2mm Vacuum Chamber Size 440*420*70mm 520*520*70mm 620*640*70mm Power Source 110V/220V 110V/220V 110V/220V Motor Power 900W 900W 900WX2 Seal...
...memory saving function Sealing Size 400*10 x2mm 500*10 x2mm 600*10 x2mm Vacuum Chamber Size 440*420*70mm 520*520*70mm 620*640*70mm Power Source 110V/220V 110V/220V 110V/220V Motor Power 900W 900W 900WX2 Seal...
...memory saving function Sealing Size 400*10 x2mm 500*10 x2mm 600*10 x2mm Vacuum Chamber Size 440*420*70mm 520*520*70mm 620*640*70mm Power Source 110V/220V 110V/220V 110V/220V Motor Power 900W 900W 900WX2 Seal...
5.0W/mk Good Thermal Conductive Heat Sink Pad for Memory Modules The TIF160N-50-10F is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This ......