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Mitsubishi Semiconductor

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Total 249 products for mitsubishi semiconductor Manufacture & Suppliers

NAND memory package substrate manufacture

... thickness:0.24mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion ......

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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UDP/USB memory substrate manufacture supporting

... brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion ......

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

Verified Supplier

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wire bonding memory substrate with gold plating manufacture

... brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion ......

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

Verified Supplier

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MGC BT Memory substrate 4L with ENEPIG plating

... brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion ......

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

Verified Supplier

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0.2mm 4L BT memory substrate manufacture JEDEC standard

... brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion ......

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

Verified Supplier

Add to cart
big capacity of memory packaging substrate manufacture

... brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion ......

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

Verified Supplier

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RF Module substrate impedance control 4L BT material soft gold

... brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion ......

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

Verified Supplier

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（0.1-0.4mm）Gold Plating Ultrathin Rigid PCB Board

...,Smart electronics,Semiconductor package,Memory package; Mini.Line space/width:1mil (25um) Spec.of pcb production: FR4 (0.2mm) finished thickness; FR4 brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseik...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

Verified Supplier

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Horexs Ultra thin MEMS package substrate manufacture supporting

...semiconductor,MEMS package,MEMS,CMOS,IC substrate,acoustics electronics,pressure electronics ,others; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:BT (0.1-0.4mm) finishe...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

Verified Supplier

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0.2mm Ultrathin MEMS packaging substrate fabrication for microphoneµelectronics

... MEMS package,semiconductors,bonding pcb,Microelectronics package; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:BT (0.1-0.4mm) finished thickness; Material brand:Mainly ...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

Verified Supplier

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FCCSP package substrate 4L Buildup types ENEPIG

Application:IC assembly,Semiconductor package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.3mm; Material brand:Mainly bra...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

Verified Supplier

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Sip package substrate BT material 4 layer ENEPIG

Application:Semiconductor,IC package,IC substrate,wearable electronics,IC assembly,Storage IC substrage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.22mm; Material brand...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

Verified Supplier

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QFN package sensors substrate manufacture supporting

Application:Semiconductor package,Sensors electronics package,QFN package,Sensors electronics,Smart electronics; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.2mm; Materia...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

Verified Supplier

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Camera Module substrate manufacture supporting China

... thickness:0.18mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion ......

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

Verified Supplier

Add to cart
0.26mm BT BGA IC Substrate Board manufacture

... thickness:0.26mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion ......

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

Verified Supplier

Add to cart
BT Memory Card BGA package Substrate 6 layer Immersion Gold

... thickness:0.22mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion ......

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

Verified Supplier

Add to cart
25um BT IC Package Substrate Soft gold plating

... thickness:0.22mm; Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others; Surface finished:Mainly immersion ......

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

Verified Supplier

Add to cart
0.15mm Thickness 2 Layers IC Package Substrate For memory package

...Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.32mm; Ma...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

Verified Supplier

Add to cart
FBGA Package substrate production supporting BT 40um core

...IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.18mm; Material brand:Mainly brand:SHENGYI,Mitsubish...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

Verified Supplier

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ENIG Wire/die Bond BGA package Substrate IC Packaging Substrate fabrication

...,IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.18mm; Material brand:Mainly brand:SHENGYI,Mitsubis...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

Verified Supplier

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