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Total 249 products for mitsubishi semiconductor Manufacture & Suppliers

BT FR4 4 Layer CSP Substrate ENEPIG Improved Tenting

.../LPDDR package substrate,Semiconductor package; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:BT (0.1-0.4mm) finished thickness; Material brand:Mainly brand:SHENGYI,Mitsu...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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L/S 30um BT Wire Bonding Substrate UL ENIG Hard Gold Soft Gold

.../SSD/LPDDR package substrate,Semiconductor package; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:FR4 (0.1-0.4mm) finished thickness; Material brand:Mainly brand:SHENGYI,...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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BT ENEPIG 4 Layer Sip Package Substrate 0.24mm Finished Thickness

Application:Sip package substrate,Semiconductor package; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:BT (0.1-0.4mm) finished thickness; Material brand:Mainly brand:SHENGYI...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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MGC brand BT CSP package Substrate Fabrication

...Dram/SSD/LPDDR package substrate,Semiconductor package; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:BT (0.1-0.4mm) finished thickness; Material brand:Mainly brand:SHENG...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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ENEPIG ENIG Soft Gold Package Substrate Customize 1-6 Layer BT Substrate

...,Dram/LPDDR package substrate,Semiconductor package; Spec.of pcb production: Mini.Line space/width:1mil (25um) Finished thickness:BT (0.1-0.4mm) finished thickness; Material brand:Mainly brand:SHENGYI,Mitsub...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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Camera / Bluetooth / Wireless Module Substrate BT 4L 0.21mm Soft Gold Finished

...Semiconductor package,Wireless modules,Power AMS module,Bluetooth module,Camera module,IC package,WIFI module/Bluetooth module,Others; Spec.of Substrate production: Mini.Line space/width:1mil (35um) Finished...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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FMC NAND / Flash Memory Substrate BT / FR4 Material 70um For Memory Cards

...Semiconductor package,UDP/USB products,Memory electronics,NAND/Flash memory,NAND Flash Memory cards, Smart Mobile devices, Notebook PC; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finishe...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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L/S 30um BT Wire Bonding Substrate ENEPIG / ENIG Hard Gold Soft Gold UL

.../SSD/LPDDR package substrate,Semiconductor package; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:FR4 (0.1-0.4mm) finished thickness; Material brand:Mainly brand:SHENGYI,...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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0.3mm FCCSP Package Substrate 4L Buildup Types ENEPIG 5*5mm BT Material

Application:IC assembly,Semiconductor package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.3mm; Material brand:Mainly bra...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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Mitsubishi Semiconductor

Total 249 products for mitsubishi semiconductor Manufacture & Suppliers