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... several types of devices; the primary GaN devices are LEDs, laser diodes, power electronics, and RF devices. GaN is ideal for LEDs because of the direct ......
...Wafers,Ge optical plates Germanium substrates Application: germanium wafer used in production of semiconductor device, infrared ray optical device, sinking material of solar cell. Main Property Terms Product...
DFB wafer N-InP substrate epiwafer active layer InGaAlAs/InGaAsP 2 4 6 inch for gas sensor DFB wafer N-InP substrate epiwafer's brief A Distributed Feedback (DFB) wafer on an n-type Indium Phosphide (N-InP) sub...
Product Description: One of the key features of this product is its maximum temperature resistance of 1700. This makes it an ideal choice for applications that require high-temperature resistance, such as sili...
Silicon Nitride Bonded Silicon Carbide Products(NSiC) NSiC Silicon Nitride Bonded Silicon Carbide Products are sort of structure ceramic material made bycasting the high-purity silicon carbide and silicon powde...
...Type A1001WV 1, Detailed specification table of product Detailed information Basic information Type Wafer Circuits From 2 pins to 24 pins Insulation O.D. 0.80mm(Max) Mating lock None Finish terminal Tin-plat...
...Type A1001WV 1, Detailed specification table of product Detailed information Basic information Type Wafer Circuits From 2 pins to 24 pins Insulation O.D. 0.80mm(Max) Mating lock None Finish terminal Tin-plat...
... Size 3/4 inch End Connection Wafer Working Pressure 300LB Medium Water, Oil, Gas, Air Body Material Carbon Steel Temp. of Medium -20℃~......
2” S Dopped GaP Semiconductor EPI Wafer N Type P Type 250um 300um Light-Emitting Diodes Description: Gallium phosphide (GaP) is a group Ⅲ-V compound. The appearance is orange-red transparent ......
Transparent Orange Undopped GaP Wafers P Type N Type 200um 350um 5G Light Emitting Description: Gallium Phosphide GaP, an important semiconductor of unique electrical properties as other III-V compound material...
GaP Semi-Insulated Wafers P Type N Type 400um 500um Green LED Red Green Light Emission Description: Gallium phosphide is a commonly used semiconductor material, which has the characteristics of high conductivit...
Mega Fit type ATX wafer header connector equivalent to Molex 5.7mm Pitch Housing with Terminal socket 6 Position pin LCP Gold Tin plating ......
...wafer connector SMT TYPE Description: 1.A1255 series is A1255WR-S-NP (Single row wafrer Mates with A1255-T series housing) 2,Wafer used materials:PA6T Pin: Phosphor Bronze /Gold-flash Solder tabs: Phosphor B...
...Wafer Connector Pitch 1.0mm 1, Detailed specification table of product Detailed information Basic information Type Wafer Circuits 12/16/20/30/40/50 positions Insulation O.D. 0.80mm(Max) Mating lock None Fini...
... terminal Tin-plated or gold-flash Mated housing A1001 series single row housing Mounting methods SMT type Wafer material Nylon 6T, UL94V-0 Cap Nylon 6T, UL94V-0 Pin material Phosphor bronze or...
...wafer connector SMT TYPE Description: 1.A1255 series is A1255WR-S-NP (Single row wafrer Mates with A1255-T series housing) 2,Wafer used materials:PA6T Pin: Phosphor Bronze /Gold-flash Solder tabs: Phosphor B...
... terminal Tin-plated or gold-flash Mated housing A1001 series single row housing Mounting methods SMT type Wafer material Nylon 6T, UL94V-0 Cap Nylon 6T, UL94V-0 Pin material Phosphor bronze or...
...Wafer Connector Pitch 1.0mm 1, Detailed specification table of product Detailed information Basic information Type Wafer Circuits 12/16/20/30/40/50 positions Insulation O.D. 0.80mm(Max) Mating lock None Fini...
...offer an excellent selection of back grinding wheels. This particular grinding tool comes in two types: a silicon wafer back grinding wheel and an LED substrate back grinding wheel. Both of them can be used ...
...offer an excellent selection of back grinding wheels. This particular grinding tool comes in two types: a silicon wafer back grinding wheel and an LED substrate back grinding wheel. Both of them can be used ...