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... up to 40*40mm, apply to BGA or CSP etc; Vacuum sensing device: Each placement head with independent detection function, which improves the stability of the equipment and the...
... up to 40*40mm, apply to BGA or CSP etc; Vacuum sensing device: Each placement head with independent detection function, which improves the stability of the equipment and the...
...*40 mm, apply to BGA or CSP etc; Vacuum sensing device: Each placement head with independent detection function, which improves the stability of the equipment and the...
...pick and place machine Machine main features Adopt High speed multi modular head, apply to ultra small chip 0201~40*40 mm large chip, wide component range; Brand new flight vision camera: Improve recognition...
...*40 mm, apply to BGA or CSP etc; Vacuum sensing device: Each placement head with independent detection function, which improves the stability of the equipment and the reliability of...
...pick and place machine Machine main features Adopt High speed multi modular head, apply to ultra small chip 0201~40*40 mm large chip, wide component range; Brand new flight vision camera: Improve recognition...
...pick and place machine Description Adopt High speed multi modular head, apply to ultra small chip 0201~10 mm large chip, wide component range; Brand new flight vision camera: Improve recognition performance,...
...pick and place machine Description Adopt High speed multi modular head, apply to ultra small chip 0201~10 mm large chip, wide component range; Brand new flight vision camera: Improve recognition performance,...
...pick and place machine Description Adopt High speed multi modular head, apply to ultra small chip 0201~10 mm large chip, wide component range; Brand new flight vision camera: Improve recognition performance,...
..., size up to 10 mm*10 mm; Vacuum sensing device: Each placement head with independent detection function, which improves the stability of the equipment and the reliability of the...
...*40 mm, apply to BGA or CSP etc; Vacuum sensing device: Each placement head with independent detection function, which improves the stability of the equipment and the...
...pick and place machine Machine main features Adopt High speed multi modular head, apply to ultra small chip 0201~40*40 mm large chip, wider component range; Brand new flight vision camera: Improve recognitio...
...180K 5 sets camera pick and place machine Production Discription The automatic placement machine is used to realize high-speed, high-precision and automatic placement of components. It is the most critical a...
... in the design and production of automated parcel lockers for package delivery and pickup services. These lockers are equipped with remote screens that display information such as delivery status, pickup ins...
...pick and place machine Machine main features Adopt High speed multi modular head, apply to ultra small chip 0201~10 mm large chip, wider component range; Brand new flight vision camera: Improve recognition p...
...pick and place machine Machine main features Adopt High speed multi modular head, apply to ultra small chip 0201~10 mm large chip, wider component range; Brand new flight vision camera: Improve recognition p...
...*40 mm, apply to BGA or CSP etc; Vacuum sensing device: Each placement head with independent detection function, which improves the stability of the equipment and the...
...pick and place machine 48000 CPH capacity Machine main features Single module X,Y,Z axis high-end magnetic linear motor, high precision than classic model Y axis double drive gantry, higher speed more stabil...
...pick and place machine Description Single module X,Y,Z axis high-end magnetic linear motor, high precision than classic model Y axis double drive gantry, higher speed more stability The placement head adopt ...
...pick and place machine Machine main features Single module X,Y,Z axis high-end magnetic linear motor, high precision than classic model Y axis double drive gantry, higher speed more stability The placement h...