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...PCB 350um Fr4 Printed Circuit Board Item Spec Layers 1~20 Board Thickness 0.1mm-8.0mm Material FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base, etc Max Panel Size 600mm×1200mm Min Hole Size 0.1mm M...
... Min Hole Size 0.1mm Min Line Width/Space 3mil(0.075mm) Board Outline Tolerance 0.10mm Insulation Layer Thickness 0.075mm--5.00mm Out Layer Copper Thickness 18um--350um Drilling Hole (Mechanical) 17um--175um...
... Min Hole Size 0.1mm Min Line Width/Space 3mil(0.075mm) Board Outline Tolerance 0.10mm Insulation Layer Thickness 0.075mm--5.00mm Out Layer Copper Thickness 18um--350um Drilling Hole (Mechanical) 17um--175um...
...PCB Board HASL OSP Capacity: Item Spec Layers 1~20 Board Thickness 0.1mm-8.0mm Material FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base, etc Max Panel Size 600mm×1200mm Min Hole Size 0.1mm Min Line...
... Min Hole Size 0.1mm Min Line Width/Space 3mil(0.075mm) Board Outline Tolerance 士0.10mm Insulation Layer Thickness 0.075mm--5.00mm Out Layer Copper Thickness 18um--350um Drilling Hole (Mechanical) 17um--175u...
... Min Hole Size 0.1mm Min Line Width/Space 3mil(0.075mm) Board Outline Tolerance 士0.10mm Insulation Layer Thickness 0.075mm--5.00mm Out Layer Copper Thickness 18um--350um Drilling Hole (Mechanical) 17um--175u...
...PCB High CTI250 CTI600 Circuit Board 175um Aluminum Item Spec Layers 1~20 Board Thickness 0.1mm-8.0mm Material FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base, etc Max Panel Size 600mm×1200mm Min H...
...PCB ISO14001 for LED Light Technical capabilities: Layers 1~20 Board Thickness 0.1mm-8.0mm Material FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base, etc Max Panel Size 600mm×1200mm Min Hole Size 0....
PCB Assembly PCBA TFT LCD Board for Mobile Phone Backlight Module Capacity: Item Spec Layers 1~20 Board Thickness 0.1mm-8.0mm Material FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base, etc Max Panel Si...
...PCB Printed Circuit Board Prototype With Green Mask Layers 1~20 Board Thickness 0.1mm-8.0mm Material FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base, etc Max Panel Size 600mm×1200mm Min Hole Size 0...
PCB manufacturing 10 floors - Rail transit 1.6 Thick, sinking gold, impedance, Shengyi TG170 PCB manufacturing 10 floors - Rail transit | GSSMT, Multilayer PCB, PCB fabrication process, HDI PCB (High-Density In...
... Min Trace: 4/4Mil Solder Mas: Green Surface Treatment: ENIG Application: Industrial Control Capabilities: Item Capability Layer Count 1-24 Layers Board Thickness 0.1mm-6.0mm Finished Board Max Size 700mm* 8...
...Layer Half Plated Hole PCB Bluetooth Module 0.8MM Board Thickness Cusomized Board Info: 1 Part NO: Half hole PCB0001 2 Layer Count: 4 Layer PCB 3 Finished Board Thickness: 0.8 MM tolerance is +/-0.1MM 4 Copp...
...Layer Half Plated Hole PCB Bluetooth Module 0.8MM Board Thickness Cusomized Board Info: 1 Part NO: Half hole PCB0001 2 Layer Count: 4 Layer PCB 3 Finished Board Thickness: 0.8 MM tolerance is +/-0.1MM 4 Copp...
...Layer BGA Rigid FR4 PCB , Blind Hole Circuit Board Fabrication Quick detail: Surface: Lead free HASL Layer number:4 Special technology:blind hole Hole:PTH Origin:China Model:XCEF Specification PCB Type: mu...
10 Layer HDI PCB, FR4, TG170, ENIG, Laser Drilling , Blind And Buried Holes 10 Layer HDI Printed Circuit Board With Blind And Buried Holes PCB Specifications: Layer Count: 10 Layer HDI PCB Board Thickness: 1.6M...
...LAYER RIGID-FLEX Printed Circuit Board , Blue Soder Mask , FR4+PI Material PCB Specifications: Layer Count: 8Layer Rigid-Flex PCB Board Thickness: 1.6MM Material: FR4 High TG+PI Structure: L1-L2 Rigid Layer,...
PCB Specifications: 4 Layer Rigid PCB Board Thickness: 1.6MM Material: FR4, TG170 Min Hole: 0.2MM Min Line: 3/3Mil BGA Size: 8Mil Solder Mask: Black Surface Treatment: ENIG Application: Industrial Control PCB P...