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White 1.2W/mK Two Compound Thermally Conductive Potting Compound for Electronic Component TIS™680-12AB Series is a two-part silicone potting adhesive with high thermal conductivity, room temperature curable,lon...
...Potting Compounds Pouring Sealant For Potting Electronic Quick Detail: Name Epoxy Resin 1477 Usage Construction, Fiber & Garment, Footwear & Leather, LED Mixing Ratio A: B =1:1 (By weight) Applications Epoxy...
...Potting Compounds Pouring Sealant For Potting Electronic Quick Detail: Name Epoxy Resin 1477 Usage Construction, Fiber & Garment, Footwear & Leather, LED Mixing Ratio A: B =1:1 (By weight) Applications Epoxy...
Key attributes Feature Low Temperature Resistance, transparent grade, High Temperature Resistance Grade Molding Place of Origin China Application Medical Grade, Food Grade Shape Liquid Two Component Brand Name ...
SEP595-F Epoxy Potting Compound For Electrical and Electronical Components 1. DESCRIPTION SEP595-F is a two-component, medium-temperature curing, epoxy potting compound. This product is environmentally friendly...
...Clear and Black variants. It features a 1:1 mix ratio by volume, 60-70 minute worklife at 23°C, designed for potting, sealing, and encapsulation of electronic components with negligible exotherm and non-corr...
Flame Resistance Thermal ConductiveTwo-Part Silicone Potting Compound And Encapsulants For Electronics Product Description Silicone potting compounds and encapsulants provide a flexible, protective barrier or e...
TIS680-12AB Gray 1.2W/MK Two Compound Thermally Conductive Potting Compound For Electronic Component TIS™680-12AB Series is a two-part silicone potting adhesive with high thermal conductivity, room temperature ...
� Product Features: Ø Double component, condensation type. Ø Room temperature curing. Ø Ethyl alcohol released after curing, non-corrosive to electronic components Ø High adhesion to all electronic components e...
Easy application epoxy potting compound glue electronic epoxy resin adhesive high thermal conductive potting epoxy adhesive TIEâ„¢380-25High Performance Thermal Conductivity Of The Epoxy Adhesive Product Summary:...
Easy Application Epoxy Potting Compound Glue Electronic Epoxy Resin Adhesive High Thermal Conductive Potting Epoxy Adhesive TIE®280-25AB is a two-component epoxy resin sealantwithgood thermal conductivity and r...
Two-Component Thermal Conductive Epoxy Resin Potting Compound Glue For Automotive Starters Potting TIE®280-25AB is a two-component epoxy resin sealantwithgood thermal conductivity and room temperature curing pr...
Two Component Silicone Thermally Conductive Potting Compound For Gluing Metal And PCB TIS ®680-10AB is a two-component potting adhesive. When Component A and Component B are mixed in a specific ratio, the adhes...
Two Components 1.0W/MK Thermally Conductive Potting Compound For 5G Base Station & Infrastructure Product Description TIS ®680-10AB is a two-component potting adhesive. When Component A and Component B are mixe...
RTV2 Condensation Cure Electronic Potting Silicone Compound for Encapsulating Description and composition 1. Dihydroxy polydimethylsiloxane 2. Polydimethylsiloxane 3. Silica hydrated Component B is the catalyst...
...Potting Compound For LED Power Supply Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. P...
High-Performance Transparent PU Encapsulant with IP68 & Long-Term UV Protection Product Description BZ-4118 is a high-performance transparent polyurethane encapsulant developed for demanding outdoor application...
Polyamide curing agent DH-115S for epoxy adhesive and potting Description DH-115S is a polyamide curing agent applicable to epoxy adhesive and potting compound formulations. It offers good flexibility, strong a...
Liquid Silicone Electronic Potting Compound For Led Encapsulation Rubber Product Description Silicone compound is supplied as a two-component addition cure system. It consists of Part A and Part B. The componen...