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6inch JGS2 Wafer DSP 1mmt Product Display 6-inch JGS2 Quartz wafer Overview The 6-inch JGS2 DSP (Double-Side Polished) wafer substrate with a thickness of 1 mm is a high-precision base material fabricated from...
Product Description: Silicon Carbide (SiC) Wafer Solutions Product Overview As the transportation, energy, and industrial markets evolve, the demand for reliable, high-performance power electronics continues to...
4'' double side polish Single Crystal Quartz Wafer AT-Cut for Resonators, Oscillators and Filters Quartz Crystals are formed thanks to hydrothermal synthesis. Production takes place in a thick pressure vessel i...
100mm 0.5mm Thick Single Crystal Quartz Wafer X-cut Y-cut for Pressure Sensor Quartz is a crystalline form of silicon dioxide (SiO2). It is a hard, brittle, transparent material with a density of 2649 kg/m3 an...
4'' 0.5mm Thickness LiTaO3 Wafer for High Frequency Broadband Filter and Piezoelectric Transducer The electromechanical coupling coefficient of LiTaO3 crystals is large, and the acoustic attenuation in the curr...
0.35mm Thickness 42°Y Lithium Tantalate LiTaO3 Wafer for Piezoelectric Sensors Lithium tantalate (LT, LiTaO3) is a kind of material with unique properties, which has a wide range of applications in both electro...
UV grade Fused Silica Wafer customized Diameter Thickness JGS1 JGS2 JGS3 BonTek works on a variety of glass and quartz materials depending on the application and requirements. The most used are three types of C...
8 Inch Dia 200mm Sapphire Wafer By 1.0mm Thickness 1sp For Epi - Ready Carrier Single crystal sapphire Al2O3 possesses a unique combination of excellent optical, physical and chemical properties. The hardest of...
Surface Acoustic Wave propagation on the Piezoelectric Wafer with Designed Cut Angles and Thickness There are some crystals that get lumped together as piezoelectric materials. The structure in these crystals a...
0.25mm Thickness 42Y Lithium Tantalate Wafer for Piezoelectric Sensors Transducers Lithium tantalate (LT, LiTaO3) is a kind of material with unique properties, which has a wide range of applications in both el...
..., 6.580*10^5 cm/s.32,43,44 Applying these values to the case of a 10*10*0.5 mm3 Y-cut LNO crystal, the thickness extensional mode should appear at 6.58 MHz. The closest observed peak is...
2 Inch Sapphire Crystal C Plane Polished Sapphire Wafers Sapphire Substrates Specification: Single crystal Al2O3 99.999% Orientation: R-axis 0.5° Diameter:50.8±0.1mm Thickness :430±15um or 330±15um Primary flat...
2 Inch 4 Inch 6 Inch Sapphire Single Crystal Wafer With Various Orientations Sizes: 2 ", 4 ", 6 "and cut small pieces; C direction, M direction, R direction; Single side polish, double side polish; Thickness: 1...
... according to customer's requirements, such as width, depth, thickness, etc., to produce unique products. The equipment is made with mature technology and standard parts for high stability. Fully automatic f...
...Thickness Aluminium Round Discs Aluminum 1060 round disc are also called pure aluminum round disc, ordinary aluminum round disc, corrosion-resistant aluminum round disc, commonly used aluminum round disc, et...
Crystal Lithium Tantalate Wafer 3inch 4inch with Customized Orientation and Thickness The present neutron study, based on 77 independent F meas, has resulted in an unambiguous determination of all nuclear posit...
100um Thick Ultra-Thin LiTaO3 Z-Cut For Pyroelectric Applications For many years the pyroelectric material lithium tantalate (LiTaO3 ) has proved itself at use in pyroelectric detectors. It fulfils not only the...
Highly Polished Sapphire Slice 0.5mm-3mm Thickness 2inch-8inch Diameter Product Description: Sapphire Wafer is a kind of high precision sapphire platelet, which is made by cutting and grinding of high quality s...
... bonding machine 2/4/6/8/12inch Compatible material Sapphire Si SiC InP GaAs GaN LT/LN Diamond Glass Semi-Automatic Room Temperature Bonding Machine is a precision device for Wafer-Level or Chip-Level bondin...
The Precision Silicon Ring (Si Ring) is a semiconductor-grade consumable component used in plasma etching, deposition, and wafer processing equipment. It functions as a focus ring, edge ring, or chamber liner r...