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TIF500-50-10U Thermal Pad 2W/MK Silicon Thermal Gap Pad Filling For Telecommunication Hardware Product descriptions TlF500-50-10U is not only designed to take advantage of the gap heat transfer, to fill gaps...
TIF®100-50-11S Wholesale 5.0W Silicone Thermal Pad Thermal Gap Filler For Automotive Electronics Product descriptions TlF®100-50-11S is recommended for applications that require a minimum amount of pressure on ...
...Silicon Thermal Pad For High Speed Mass Storage Drives Product descriptions TlF®500-20-11US Series is an ultra-soft thermal interface material designed specifically to protect precision components that are e...
...Silicon Thermal Pad For RDRAM Memory Modules Product descriptions TlF®500-18-11U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely_se...
TIF700M Highly Efficient Thermal Conductivity 6.0 W/MK Heat Resistant Silicone Thermal Pads Product descriptions TlF®700M is recommended for applications that require a minimum amount of pressure on components....
...component and different temperature curing system. The product was supplied as highly thermal conductive, soft and elastomer for coupling on electrical devices modul. Heat can transmit to the metal housing o...
TIF®600P Premium Soft Silicone Thermal Pad For AI Processors The TIF®600P Series is a well-balanced,general-purpose thermal pad. It offers excellent thermal conductivity and moderate hardness . This balanced de...
... components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with an exceptionally gel-like softness, achieving a low-stress perfect fit. It is suitable for ...
... interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softnes...
... material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness,achievin...
10.0mm Thickness Silicone Thermal Conductivity Pad For Telecommunications Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink Visual Thickness (mm) 0.5~12.0 ASTM d374 Density (g/cc) 2...
Blue Silicone Thermal Pads High Temperature Resistance And Non Conductive Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink Visual Thickness (mm) 0.5~12.0 ASTM d374 Density (g/cc) 2...
10.0mm Thickness Silicone Thermal Conductivity Pad For Telecommunications Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink Visual Thickness (mm) 0.5~12.0 ASTM d374 Density (g/cc) 2...
Blue Silicone Thermal Pads High Temperature Resistance And Non Conductive Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink Visual Thickness (mm) 0.5~12.0 ASTM d374 Density (g/cc) 2...
...flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink. TIF100-40-11US-Series-Datasheet...
...Thermal Pad Thermally Conductive Silicon Protective Cushioning Material The TIF100-30-11S thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeabi...
BAIYUN SGH233 Thermo conducting grease eletronic thermal condutive sealant electronics sealant led thermal grease BAIYUN SGH233 Thermo-conducting Grease 1, Features Innocuous, smell-less and non-corrosive, ex...
1mmT High Quality And High Conductivity 3w Green Silicone Thermal Conductive Pad For Advanced Cooling Needs The TIF140-30-05S Series is not only designed to take advantage of the gap heat transfer, to fill gap...
3.0W Silicon Thermal Gap Filler Pad For PC DVR Digital Video Recorder Set Top Box Applied The TIF100-30-25E is not only designed to take ......
Ultra soft Gray 3.0W/MK Silicone Thermal Pad With 27 Shore 00 For WiFi Modules The TIF®500-30-11U is recommended for applications that require a minimum amount of pressure on ......