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...Silicone Thermal Pad For Semiconductor Heat Dissipation Product descriptions The TIF®200-10-02ES Series is a compound thermal interface material that combines good thermal conductivity,reliable electrical in...
Thermal Conductive Pad Soft Compressible Silicone Thermal Interface Material For Heat Transfer The TIF®100-15-01F Series is a structurally supportive thermal pad designed to provide good heat dissipation while ...
Thermally Conductive Silicone Thermal Pad Suitable For Heat Sink Applications And Electronic Device Protection The TIF®100-15-11F Series is a structurally supportive thermal pad designed to provide good heat di...
Soft Silicone Thermal Pad Thermal Interface Material With High Compression Performance For Electronic Devices Cooling Product descriptions TIF®100-30-01UF Series is a structural support thermal pad, designed to...
Product Description: With a Shore hardness of 30±5, this thermal pad is both flexible and durable, providing excellent shock absorption and vibration resistance. Its elongation at break of 90%~100% ensures that...
... performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra low modulus resin formulation. Ziitek ...
High Thermal Conductive Pad For Automotive Silicon Thermal Pad Product descriptions The TIF®100-20-02S is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer b...
...Silicone Thermal Pad For EV Battery Product descriptions TlF®700HQ is an extremely soft gap filling material rated at a thermal conductivity of 8.0W/m-K. It is specially formulated for high performance appli...
... It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra lo...
TIF®500-50-10U Thermal Pad 2W/MK Silicon Thermal Gap Pad Filling For Telecommunication Hardware​ Product descriptions TlF®500-50-10U is not only designed to take advantage of the gap heat transfer, to fill gaps...
...Silicon Thermal Pad For High Speed Mass Storage Drives Product descriptions TlF®500-20-11US Series is an ultra-soft thermal interface material designed specifically to protect precision components that are e...
...Silicon Thermal Pad For RDRAM Memory Modules Product descriptions TlF®500-18-11U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely_se...
TIF700M Highly Efficient Thermal Conductivity 6.0 W/MK Heat Resistant Silicone Thermal Pads Product descriptions TlF®700M is recommended for applications that require a minimum amount of pressure on components....
...component and different temperature curing system. The product was supplied as highly thermal conductive, soft and elastomer for coupling on electrical devices modul. Heat can transmit to the metal housing o...
High Conductivity Heat Transfer Silicone Thermal Pads For Mainboard/Mother Board Product descriptions TlF®100-18-56E Series is a well-balanced,general-purpose thermal pad.It offers good thermal conductivity and...
TIF®600P Premium Soft Silicone Thermal Pad For AI Processors The TIF®600P Series is a well-balanced,general-purpose thermal pad. It offers excellent thermal conductivity and moderate hardness . This balanced de...
... components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with an exceptionally gel-like softness, achieving a low-stress perfect fit. It is suitable for ...
... interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softnes...
... material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness,achievin...
...-precision applications. Its soft and elastic material can fill the uneven gaps between heating elements and heat sinks or metal bases, limprove thermal conductivity efficiency,and...