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0116 TDS-EN.pdf Product Description Silicone thermally conductive compound White paste Non-curing type Product Features Thermal conductivity: 3.2 W/ m·K Solvent-free, metal powder-free for insulation requiremen...
...white; Physical form: paste; Wide working temperature range; Nontoxic, non-corrosive to PCB and metal; Eco-friendly, odorless; Maintain dry and flowing at ......
...dry-hang structural sealant, neutral curing sealant, silicon building adhesive Introduction of 9767 9767 is two-component, brown, paste, room temperature curing structural bonding epoxy sealant. It is dedica...
0117 TDS-EN.pdf Product Description Silicone thermally conductive compound Gray paste Non-curing type Product Features Thermal conductivity: 4.0 W/ m·K It contains metal powder to enhance thermal conductivity a...
... has Underwriters Laboratory Flammability Classification 94V-O. • Surge overload ratings to 400 Amperes . MECHANICAL DATA Case:Molded plastic with heatsink integrally mounthed in the bringe encapsulation. Te...
1.5mm Thickness 3.0W/m.K Thermal Conductivity Pad Cooling Gap Filler For High-speed hard drive Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Light Blue Visual Thickness(mm) 0.3~10.0 ...
8 W/m.K Thermal Conductivity Pink 10 mm Thickness Thermal Pad Material For Heatsink Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink Visual Thickness(mm) 0.5~10 astm d374 Density(g...
0.25mm Thickness 1.4W/m.K Yellow Silicone Thermal Insulation Pad For Telecommunications Attribute Value Test Method Product TC1500B - Composition Silicone + Fiberglass Carrier - Color Yellow Visual Thickness(mm...
1.4W/m.K Thermal ConductivityYellow Silicone Soft Thermal Insulation Pad For Heat-Sink GPU Attribute Value Test Method Product TC1500B - Composition Silicone + Fiberglass Carrier - Color Yellow Visual Thickness...
1.5mm Thickness 3.0W/m.K Thermal Conductivity Pad Cooling Gap Filler For High-speed hard drive Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Light Blue Visual Thickness(mm) 0.3~10.0 ...
8 W/m.K Thermal Conductivity Pink 10 mm Thickness Thermal Pad Material For Heatsink Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink Visual Thickness(mm) 0.5~10 astm d374 Density(g...
0.25mm Thickness 1.4W/m.K Yellow Silicone Thermal Insulation Pad For Telecommunications Attribute Value Test Method Product TC1500B - Composition Silicone + Fiberglass Carrier - Color Yellow Visual Thickness(mm...
1.4W/m.K Thermal ConductivityYellow Silicone Soft Thermal Insulation Pad For Heat-Sink GPU Attribute Value Test Method Product TC1500B - Composition Silicone + Fiberglass Carrier - Color Yellow Visual Thickness...
...Silicon Carbide Schottky Diode offers zero reverse recovery current and zero forward recovery voltage, featuring a positive temperature coefficient on VF and temperature-independent switching. It operates at...
... unipolar nature eliminates switching losses, enabling high efficiency and reducing the need for large heatsinks. This diode is suitable for parallel operation without thermal runaway and is ideal for applic...
... temperature coefficient on VF and temperature-independent switching. With a 175C operating junction temperature, it enables the replacement of bipolar devices, reduction of heatsink size, and parallel opera...
...Silicon Carbide Schottky Diode designed for high-performance power applications. It features zero reverse recovery current and zero forward recovery voltage, along with a positive temperature coefficient on ...
... losses. This unipolar device offers a positive temperature coefficient on VF, enabling parallel operation without thermal runaway and allowing for smaller heatsink sizes. With...