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...Conductive Glass Film Spraying Process Description: The ultrasonic nano level conductive glass film spraying process is an efficient thin film preparation technology. It uses high-frequency ultrasonic waves ...
1. Product name: Silver alloy contacs Another name: Electrical contact, Contact materials, Contactor, Fixed or Movable contact. 2. Ususl Materials: Materials of Contacts-Longsun.pdf AgNi series: AgNi10, AgNi15,...
...Conductive Adhesive Transfer Tape with 0.1mm / 0.5mm Thickness The TIA™810FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. Thi...
...Conductivity Adhesive Fabric Tape The TIA™806FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesive tape posse...
.... This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of lubricating grease and mechanical fixing. TIA800FG Serie...
.... This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of lubricating grease and mechanical fixing. Features >...
.... This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of lubricating grease and mechanical fixing. TIA810FG Serie...
.... This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of lubricating grease and mechanical fixing. Features >...
...Conductive Acrylic Tape for LED strip The TIA™800FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesive tape p...
...Conductive Adhesive For Led Fluorescent Lamp The TIA™800FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesive...
...Conductive tape 0.9 W/MK The TIA™810FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesive tape possesses ulti...
...conductive adhesive fire resistance tape TIA608P 0.2mm thickness for bonding heat microprocessors The TIA608P Series products are mostly used for bonding heat dissipation fins, microprocessors and other powe...
...Conductive Tape For PC The TIA™800 Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesive tape possesses ultimate...
Bronze Oilless Bearing Good Thermal Conductivity Compact Structure Anti Corrosion 1. Product Description Customizable Oil / Grease Groove Casting Bronze Sleeve & Flange Bearings with oil grooves enable the bush...
...Conductive Thermal Adhesive Tape with double-sided adhesive The TIA™800FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This t...
...Conducting Double-Sided Adhesive The TIA™800FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesive tape posses...
...Conductive Tape for LED Light Heat dissipation tape The TIA™800FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of a...
...Conductive Double-sided Adhesive Tape for LED and heat sink The TIA™600 Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This typ...
...Conductivity Double-Side Adhesive Tape Heat Transfer Thermal Tape For LED And Heat Sink The TIA™600P Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consump...