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...chip inductors with high self resonate frequency, low DCR,1.0nH to 470nH inductance,300mA current Features: Advanced thin film technology Miniature size 0402C/0603C available Small size, no lead is suitable...
...chip inductors,Multilayer Chip Inductor,Ferrite Beads Motherboard Inductor,SMD inductor Features: Avoids crosstalk High reliability Excellent solderability Closed magnetic circuit Closed magnetic circuit avo...
...solder High thermal conductivity package, electrically insulated case Polarity symbols are moulded on body of the plastic box Center hole fixing Glass passivated diode chips Excellent power/ volume ratio Nic...
...chip junctions · High surge current capability · High temperature soldering guaranteed 260℃/10 seconds, 0.375”(9.5mm) lead leCM GROUPh 5 lbs. (2.3Kg) tension MECHANICAL DATA · Case: molded plastic body · Ter...
...-140lm Chip Brand US Bridgelux Chip Brand Color Temperature US Bridgelux 3800-4200k/ 2800-3150K / 5800-6300k / 6500-7500K Feature 1.1 Package Size: 3.0*3.0*0.65mm 1.2 Light-emitting Type 1.3 Soldering Method...
SMBJ170A-E3/52 Peak pulse power 600W Stand-off Voltage 17V VISHAY Features Case: DO-214AA/SMB For surface mounted applications in order to optimize board space. Polarity: Color band denoted positive end (cat...
...Temperature 3800-4200k/ 2800-3150K / 5800-6300k / 6500-7500K Chip Brand Bridgelux Feature 1.1 Package Size: 3.0*3.0*0.62mm 1.2 Emitted Color: Whit 1.3 Light-emitting Type 1.4 Soldering Method: SMT Reflow Sol...
...chip Original integrated circuit : A BGA (Ball Grid Array) microcontroller IC chip is a type of integrated circuit that uses a ball grid array to connect the chip to a printed circuit board (PCB). In a BGA p...
...chip COB package uses MIni/Micro LED chips. 2.lt is directly integrated and packaged on the PCB board through solid crystal and molding methods. 3.Simplified the packaging process of the entire chip without ...
...chip COB package uses MIni/Micro LED chips. 2.lt is directly integrated and packaged on the PCB board through solid crystal and molding methods. 3.Simplified the packaging process of the entire chip without ...
...chip COB package uses MIni/Micro LED chips. 2.lt is directly integrated and packaged on the PCB board through solid crystal and molding methods. 3.Simplified the packaging process of the entire chip without ...
...chip COB package uses MIni/Micro LED chips. 2.lt is directly integrated and packaged on the PCB board through solid crystal and molding methods. 3.Simplified the packaging process of the entire chip without ...
...chip COB package uses MIni/Micro LED chips. 2.lt is directly integrated and packaged on the PCB board through solid crystal and molding methods. 3.Simplified the packaging process of the entire chip without ...
...chip COB package uses MIni/Micro LED chips. 2.lt is directly integrated and packaged on the PCB board through solid crystal and molding methods. 3.Simplified the packaging process of the entire chip without ...
...chip COB package uses MIni/Micro LED chips. 2.lt is directly integrated and packaged on the PCB board through solid crystal and molding methods. 3.Simplified the packaging process of the entire chip without ...
...chip COB package uses MIni/Micro LED chips. 2.lt is directly integrated and packaged on the PCB board through solid crystal and molding methods. 3.Simplified the packaging process of the entire chip without ...
...chip COB package uses MIni/Micro LED chips. 2.lt is directly integrated and packaged on the PCB board through solid crystal and molding methods. 3.Simplified the packaging process of the entire chip without ...
...chip COB package uses MIni/Micro LED chips. 2.lt is directly integrated and packaged on the PCB board through solid crystal and molding methods. 3.Simplified the packaging process of the entire chip without ...
...chip COB package uses MIni/Micro LED chips. 2.lt is directly integrated and packaged on the PCB board through solid crystal and molding methods. 3.Simplified the packaging process of the entire chip without ...
...chip COB package uses MIni/Micro LED chips. 2.lt is directly integrated and packaged on the PCB board through solid crystal and molding methods. 3.Simplified the packaging process of the entire chip without ...