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... Inspection Online Single-Track Model K2005 Testing Capability Test items CHIP component body, CHIP component solder joints, characters, DIP solder joints Minimum component CHIP:01005 Pitch:0.3mm Detection M...
...2m online Single-Track Model K2005XL1200 Testing Capability Test items CHIP component body, CHIP component solder joints, characters, DIP solder joints Minimum component CHIP:0402 Detection Method Deep Learn...
... Online dual track Model K2005DT Testing Capability Test items CHIP component body, CHIP component solder joints, characters, DIP solder joints Minimum component CHIP:01005 Pitch:0.3mm Detection Method Algor...
... track Model K2012DT Testing Capability Test items CHIP component body, CHIP component solder joints, characters, DIP solder joints Minimum component CHIP:01005 Pitch:0.3mm Detection Method Algorithm Paramet...
... component CHIP:0201 Pitch:0.3mm Detection method Algorithm parameter debugging, machine learning Optical system Camera 12MP high-speed ......
... Inspection Online Single-Track Model K2012 Testing Capability Test items CHIP component body, CHIP component solder joints, characters, DIP solder joints Minimum component CHIP:01005 Pitch:0.3mm Detection M...
... Online dual track Model K2012DT Testing Capability Test items CHIP component body, CHIP component solder joints, characters, DIP solder joints Minimum component CHIP:01005 Pitch:0.3mm Detection Method Algor...
...2m online Single-Track Model K2005XL1200 Testing Capability Test items CHIP component body, CHIP component solder joints, characters, DIP solder joints Minimum component CHIP:0402 Detection Method Deep Learn...
...Melting, joining and solidification of two coated metal layers by application of heat to the surface and pre-deposited solder paste. Wave Soldering: A manufacturing operation in which solder joints are solde...
...Melting, joining and solidification of two coated metal layers by application of heat to the surface and pre-deposited solder paste. Wave Soldering: A manufacturing operation in which solder joints are solde...
...suggested to regard A solder joint as Lline, B solder joint as N line, and wire the copper foih counected widl B solder joint around the pressure sensitive chip (the whole dliameter D should be regarded as b...
...suggested to regard A solder joint as Lline, B solder joint as N line, and wire the copper foih counected widl B solder joint around the pressure sensitive chip (the whole dliameter D should be regarded as b...
... flux per LED Low-temp & lead-free reflow soldering More energy-efficient than incandescent and most halogen lamps Low Voltage DC operated Long lifespan 50,000 hours Technical ......
...a precise and critical manufacturing process, its process covers a number of rigorous steps. The first is the solder paste printing link, the high-precision solder paste press will paste evenly on the solder...
SMD Reel Counter Intelligent SMD Counting Machine SMT SMD chip counter SMD chip counter Specifications 1. Full automactic counting, high accuracy, no error. 2. No risk of damage the tapes, we have designed to p...
...-ready—our chip trays are built for semiconductor production lines. High-temperature resistance waffle pack tray is specifically designed to support semiconductor and microelectronic components during therma...
... MULTILAYER CERAMIC CHIP CAPACITORS FEATURES • Improved board bending resistance, drop impact resistance, thermal shock resistance, and heat cycle properties. • Conductive resin absorb external stress to pro...
... chip junction • Ideal for automated placement • Ultrafast recovery times for high efficiency • Low forward voltage, low power losses • High forward surge capability • Meets MSL level 1, per J-STD-020, LF ma...
... passivated chip junction • Ideal for automated placement • Ultrafast reverse recovery time • Low switching losses, high efficiency • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maxi...
... placement • Glass passivated chip junction • Ultrafast reverse recovery time • Low switching losses, high efficiency • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 26...