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...TRI COLOR SMD LED CHIP Features: (1)suitable for all SMT asembly methods. (2)compatible with infrared and vapor phase reflow solder process. (3)compatible with automatic placement equipment. (4)This product ...
...YELLOW BI-COLOR CHIP LED Features: (1)suitable for all SMT asembly methods. (2)compatible with infrared and vapor phase reflow solder process. (3)compatible with automatic placement equipment. (4)This produc...
... RED AND GREEN AND BLUE BI-COLOR CHIP LED Features: (1)suitable for all SMT asembly methods. (2)compatible with infrared and vapor phase reflow solder process. (3)compatible with automatic placement equipmen...
...SMD LED CHIP Features: (1)suitable for all SMT asembly methods. (2)compatible with infrared and vapor phase reflow solder process. (3)compatible with automatic placement equipment. (4)This product doesn't co...
... PURPLE SMD LED CHIP Features: (1)suitable for all SMT asembly methods. (2)compatible with infrared and vapor phase reflow solder process. (3)compatible with automatic placement equipment. (4)This product do...
... BICOLOR SMD LED CHIP Features: (1)suitable for all SMT asembly methods. (2)compatible with infrared and vapor phase reflow solder process. (3)compatible with automatic placement equipment. (4)This product d...
...EE COLOR SMD LED CHIP Features: (1)suitable for all SMT asembly methods. (2)compatible with infrared and vapor phase reflow solder process. (3)compatible with automatic placement equipment. (4)This product d...
...TRI COLOR SMD LED CHIP Features: (1)suitable for all SMT asembly methods. (2)compatible with infrared and vapor phase reflow solder process. (3)compatible with automatic placement equipment. (4)This product ...
...SMD LED CHIP Features: (1)suitable for all SMT asembly methods. (2)compatible with infrared and vapor phase reflow solder process. (3)compatible with automatic placement equipment. (4)This product doesn't co...
...LED. 3. Grand A raw material for module frame and mask. 4. 4 layers PCB and copper plating thickness > 18mil. 5. Ag alloy solder paster to ensure good soldering on PCB. 6. Stainless steel screws when assembl...
... - Complete Product (Assembly - Box Build) - ICT test and Function Test - Lead-Free Soldering - Flexible PCBA Testing Methods AOI Testing Checks for solder paste Checks for components down to 0201" Checks fo...
... - Complete Product (Assembly - Box Build) - ICT test and Function Test - Lead-Free Soldering - Flexible PCBA Testing Methods AOI Testing Checks for solder paste Checks for components down to 0201" Checks fo...
...chip Built-in strain relief, ideal for automated placement Plastic material used carries Underwriters Laboratory Classification 94V-0 MECHANICAL DATA Case: JEDEC DO-214AA molded plastic body over passivated ...
... 1. Evenly out of the wind to ensure that the four corners of the chip solder melt simultaneously 2. Accurate temperature, not bake chips 3. Do not need to dry circuit boards and chips before desoldering chi...
...chip in laptop, mobile phone, xbox360,ps3,etc. The main user is repairing shops and factory to provide the after-sales service and rework. How to separate BGA chip from motherboard? How to replace a new BGA ...
...chip in laptop, mobile phone, xbox360,ps3,etc. The main user is repairing shops and factory to provide the after-sales service and rework. How to separate BGA chip from motherboard? How to replace a new BGA ...
... Grand A row material for module frame and mask. 4. 4 layers PCB and copper plating thickness > 18mil. 5. Ag alloy solder paster to ensure good soldering on PCB. 6. Stainless steel screws when assembly. 7. D...
... A row material for module frame and mask. 4. 4 layers PCB and copper plating thickness > 18mil. 5. Ag alloy solder paster to ensure good soldering on PCB. 6. Stainless steel screws when assembly. 7. Disasse...
...chip from Taiwan Epistar. 2. With pure golden wire connection in LED. 3. Grand A row material for module frame and mask. 4. 4 layers PCB and copper plating thickness > 18mil. 5. Ag alloy solder paster to ens...
... chip from Taiwan Epistar. 2. With pure golden wire connection in LED. 3. Grand A row material for module frame and mask. 4. 4 layers PCB and copper plating thickness > 18mil. 5. Ag alloy solder paster to en...