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...Blade , Diamond Stone Cutting Blades for Dry and Wet Cutting Hot pressed sintered diamond turbo saw blades are designed for professional high speed cutting of a wide range of materials (granite, marble, conc...
...blade for Concrete / Brick Block / Masonry / Stone 1. Description of 115mm Laser Welded Diamond Tuck Point Blade Cutting Blade We are China Professional Manufacture of Laser Welded Tuck Point Diamond Saw Bla...
... to 1800mm. This 300mm blades can be installed on the hand held power saw and walk behind saw etc. With high cutting speed and no chipping. Client feedbacks are very good. The Sample ......
Super thin cutting wheel for Copper ear/Copper terminals/Collet AUTOFOR super thin cutting wheel enables to cut/slot/gap the metal,like copper ear,copper terminals,collet. The precision is very high. Autofor di...
...Blade ( steel cutting blade)DMO5 saw blade Specification: size: Out Diameter 200-600mm, bore 25-50mm, thickness 1-5mmSurface coating: Original colour, Tin(Titanium)-coated or Azoted, TiAl Types: Teeth or Tee...
... using new electroforming technology. These blades are widely used for dicing semiconductor wafers, resistance, ceramics, semiconductor encapsulating materials and more. For more information about these supe...
... using new electroforming technology. These blades are widely used for dicing semiconductor wafers, resistance, ceramics, semiconductor encapsulating materials and more. For more information about these supe...
... using new electroforming technology. These blades are widely used for dicing semiconductor wafers, resistance, ceramics, semiconductor encapsulating materials and more. For more information about these supe...
... using new electroforming technology. These blades are widely used for dicing semiconductor wafers, resistance, ceramics, semiconductor encapsulating materials and more. For more information about these supe...
... using new electroforming technology. These blades are widely used for dicing semiconductor wafers, resistance, ceramics, semiconductor encapsulating materials and more. For more information about these supe...
... using new electroforming technology. These blades are widely used for dicing semiconductor wafers, resistance, ceramics, semiconductor encapsulating materials and more. For more information about these supe...
...Blade , Segmented Circular Disc for Cutting Masonry Description: Super Turbo-T Rim saw blade: Diamond concave cutting blade 9 inch(230mm) cutting blade Dry cutting, working without water Turbo rim grinds the...
...,ceramic,tile. 2.Saw blade Specifications: Item name Segment size (mm) Diameter Thickness Height General Purpose 4'' 1.8 4.5'' 2 7/10/12 5'' 2 6'' 2.1 7'' 2.2 9'' 2.4 10'' 3 3.More pictures 4.What is your ad...
... saw or quick cut) is a power tool used for cutting concrete, masonry, brick, asphalt, tile, and other solid materials. The saw blades used on concrete saws are often diamond saw blades to cut concrete, asph...
...Blade For Ceramic With Long Life Description of tile tools cutting diamond saw blades for ceramic. Hot pressed super-thin diamond turbo blade is a new type mesh diamond saw balde. Especially suitable for cut...
...Blade For Ceramic With Long Life Description of tile tools cutting diamond saw blades for ceramic. Hot pressed super-thin diamond turbo blade is a new type mesh diamond saw balde. Especially suitable for cut...
...,ceramic,tile. 2.Saw blade Specifications: Item name Segment size (mm) Diameter Thickness Height General Purpose 4'' 1.8 4.5'' 2 7/10/12 5'' 2 6'' 2.1 7'' 2.2 9'' 2.4 10'' 3 3.More pictures 4.What is your ad...
... height will guanartee a good life span and cutting fastly. 2.Saw blade Specifications: Item name Segment size (mm) Steel core Segment (pcs/set) Central hole (mm) Diameter Length Thickness Height Diamond saw...
... using new electroforming technology. These blades are widely used for dicing semiconductor wafers, resistance, ceramics, semiconductor encapsulating materials and more. For more information about these supe...
... using new electroforming technology. These blades are widely used for dicing semiconductor wafers, resistance, ceramics, semiconductor encapsulating materials and more. For more information about these supe...