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... allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of ha...
...a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -45℃~200℃ and meet the requirement of UL94V0. Features > Good thermal conductiv...
...economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -45℃~200℃ and meet the requirement of UL94V0. Features > Good th...
Thermally Conductive Sheet Pads Silicon Thermal Pad For Cooling Components To The Chassis Of Frame Product descriptions The TIF®500-20-11U Series is an ultra-soft thermal interface material designed specificall...
...Thermal Conductivity 8.0W/MK Thermal Gap Filler Pad For CPU And GPU Processors Product descriptions TS-TIF®100C 6530-11 series is a silicone-based thermal material designed to fill the gaps between heat-gene...
... and liquid cooling plates or metal bases.lts flexibility and elasticity make it ideal for covering highly uneven surfaces.With excellent thermal conductivity, it efficiently transfers heat from...
...Thermal Conductive Pad Gap Filling Materials Silicone Thermal Pad For LED CPU Laptop Product descriptions TlFTM100-06S Series is a silicone based, thermally conductive gap pad. Its unreinforced construction ...
...Thermal Conductivity Resistant Flame-Retardant Insulation 7.5W/MK Silicone Thermal Pad Product descriptions TlF500-75-11U Series is a silicone based, thermally conductive gap pad. Its unreinforced constructi...
...Thermal Pad With Thermal Conductivity 1.2W/M.K Work For Computer Laptop Desktop CPU Cooling Products description Ziitek TIF™100-20-11PSA series is a silicone based, thermally conductive gap pad. Its unreinfo...
... material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness,achievin...
TIF600G Good Insulation Performance 6W/MK Thermal Conductivity Thermal Pad For AI Processors The TIF600G Series is a well-balanced,general-purpose thermal pad. It offers excellent thermal conductivity and mode...
...Thermal Conductivity Die Cut Silicon Thermal Pad For AI Processors AI Servers The TIF®700PU Series is a thermal pad specifically designed to tackle the high level cooling challenges and environments sensitiv...
... material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness,achievin...
... material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness,achievin...
...material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with an exceptionally gel-like softness,achie...
...Thermal Pad 100x100mm Highly Efficient Thermal Conductivity 4.0W/MK Heat Resistant High Temperature Product descriptions The TIF®100L 4035-06 Series is a soft, low-volatility thermal pad designed specificall...
... interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softnes...
Naturally tacky blue Good Thermal Conductive pad For CPU Heat Dissipation 1.5 W/mK RoHS compliant TIF100-05E 35 Shore 00 The TIF100-05E Series thermally conductive interface materials are applied to fill the ai...
LCD TV Silicone Rubber Thermal Conductive Pad Cooling High Adhesive 2W/mK The TIF100-20-10F Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the...
TIF100-20-05S blue High Thermal Conductive Pad For CPU Heat Dissipation 2.95 g / cc Specific Gravity 2.0W/mK The TIF100-20-05S thermally conductive interface materials are applied to fill the air gaps between ...