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...Thermal Gap Filler TIF180-20-07E 2.032 mm Silicone rubber sheet in 35shore00 hardness The TIF180-20-07E is a high performance and compatible non-silicone material of the thermal conductive interface material...
...Thermally Conductive Adhesive Transfer Tape with 0.1mm / 0.5mm Thickness The TIA™810FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semicondu...
...Thermal Adhesive Tape Easy To Stamping Processing For LED Mount Heat Sink The TIA™808FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semicond...
...dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to re...
... power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of lubricating grease and ...
...Thermal Conductive Glue with Two Component Fire Resistant Silica Encapsulant TIS™ 680-28AB is a two-component, high thermal conductive, low temperature cured, long pot life, fire resistant Silica encapsulant...
... power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of lubricating grease and ...
... and other power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of lubricating g...
...Thermal Conductive Acrylic Tape for LED strip The TIA™800FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesiv...
...Thermal Conductive Adhesive For Led Fluorescent Lamp The TIA™800FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of ...
...Thermal Imaging Module for Ground Surveillance FEATURES: l Uncooled VOx FPA Microbolometer, high sensitivity and high resolution. l New generation FPGA intelligent image processing provides clear image. l Mu...
...Thermally Adhesive Tape For LED Mount Heat Sink Conductive tape 0.9 W/MK The TIA™810FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semicondu...
...Thermal Adhesive Tape 1.2 W/mK For Led Fluorescent Lamp 0.1~0.5mmT The TIA™800FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors....
...Thermal Adhesive Tape For LED Mount Heat Sink with 0.8 W/mK double adhesive The TIA™820FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semico...
.... Thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to ...
...Thermal Pad 4.0W/MK With 45 Shore 00 Hardness For RDRAM Memory Modules The TIF100-40-11S Series is recommended for applications that require a minimum amount of pressure on components. The viscoelastic natur...
...thermal adhesive double side tape fire resistance equate 94 V-0 The TIA™605P Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. Th...
Thermal conductive adhesive fire resistance tape TIA608P 0.2mm thickness for bonding heat microprocessors The TIA608P Series products are mostly used for bonding heat dissipation fins, microprocessors and other...
...fins, microprocessors and other power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the me...
... for potting of capacitors and electrical devices.Their flexibility and elasticity make them suited to the coating of the very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from...