| Sign In | Join Free | My burrillandco.com |
|
...Thermal Potting Compound | ≥0.76 W/m·K | Power Electronics Encapsulation Product Overview for silicone potting compound: Two-Part Addition-Cure Silicone Potting Rubber for Electronics.Featuring an ultra-low ...
Shin-Etsu KS-64 Silicone Grease Compound for Electric and Electronic Equipment Insulation and Sealing Shin-Etsu KS-64 is a white grease-like silicone oil compound designed for insulation and sealing in electric...
Attribute Value Test Method Composition Non-Vulcanized Silicone Oil and Thermally Conductive Filler Mixture - Color White Visual Density(g/cc) 2.8 ASTM D792 Usage Temperature(℃) -40~150 -- Thermal Thermal condu...
Attribute Value Test Method Composition Non-Vulcanized Silicone Oil and Thermally Conductive Filler Mixture - Color White Visual Density(g/cc) 2.8 ASTM D792 Usage Temperature(℃) -40~150 -- Thermal Thermal condu...
BZ-3911-1.5: 1.5 W/m·K High Performance Thermal Silicone Gel Product Description BZ-3911-1.5 is a low-viscosity, two-component addition-cure silicone gel designed for thermal management and environmental protec...
BZ-3501: 2.0 W/m·K High Performance Thermal Silicone Gel Product Description BZ-3501 is a high-performance two-component addition-cure silicone gel designed for thermal management and environmental protection i...
...Thermal Grease - Advanced TIM for Microprocessor Cooling Basic Product Attributes Shin-Etsu X-23-7783D is a gray, high-viscosity thermal grease designed for cooling high-performance microprocessors, with th...
... High Performance Cpu Thermal Grease Thermal Grease Cpu For Sale 1Kg Product Simple Attributes Shin-Etsu X-22-8033-1 is a high-performance thermal grease designed for semiconductor equipment, featuring excel...
...Thermal Grease for Electronics Thermal Management Product Properties DOWSIL™ TC-5628 is a one-part, blue, thermally conductive grease. It features excellent thermal conductivity (4.0 W/m·K) and low thermal r...
... grease composed of thermally conductive fillers and a siloxane polymer matrix, delivering 1.0 W/mK thermal conductivity with high-temperature stability. Product Description Formulated with metal oxide-fille...
...Thermal Grease for High-Performance Processors Product Introduction: Shin-Etsu X-23-7921-5 Thermal Grease Basic Properties Shin-Etsu X-23-7921-5 is a non-solvent thermal interface material designed for high-...
...Thermal Grease | Single-Part 2.8W/mK Pump-Out Resistant Electronics Cooling Basic Product Properties TC-5121 C is a single-part, non-curing thermal grease with greenish-yellow viscosity. It delivers 2.8W/mK ...
...Thermal Grease for High-Performance Processors Basic Product Attributes Thermal Grease (with Application Chemical) Color: Grey Compliance: RoHS & REACH Compliant Attribute Typical Value Thermal Conductivity ...
...1.0 W/m·K, very low oil bleed (<0.01% at 150°C/24 hrs), and high volume resistivity (2.89 x 10¹⁵ Ω·cm). This grease is designed for gap-filling applications and offers a shelf life of 12 months at 25°C. Product Introduction DOWSIL™ CN-8880 is a...
... and form into'shape either at room temperature or under heating conditions. After curing, it forms a dense elastomer with integrated performance characteristics: good thermal conductivity,...
0112 TDS-EN.pdf 0112 is a one-component Silicone Thermal Conductive Grease suitable for gap filler and reducing the temperature of electronic components. Product Features: One-component, white; Physical form: p...
...Thermal Conductive Grease suitable for gap filler and reducing the temperature of electronic components. Product Features: One-component, grey; Physical form: paste; Wide working temperature range; Nontoxic,...
0112G TDS-EN.pdf 0112G is a one-component Silicone Thermal Conductive Grease suitable for gap filler and reducing the temperature of electronic components. Product features: One-component, white; Physical form:...
...Thermal Grease for CPU GPU Heat Dissipation Interface Material Shin-Etsu MicroSi X-23-8195-4 is a one-part, solvent-free silicone-based thermal grease filled with spherical ceramic particles (Al₂O₃ and ZnO),...
� Product Features: Ø Double component, condensation type. Ø Room temperature curing. Ø Ethyl alcohol released after curing, non-corrosive to electronic components Ø High adhesion to all electronic components e...