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... and liquid cooling plates or metal bases.lts flexibility and elasticity make it ideal for covering highly uneven surfaces.With excellent thermal conductivity, it efficiently transfers heat from...
... gap filling material. It is provide with two-component and different temperature curing system. The product was supplied as highly thermal conductive, soft and elastomer for coupling on electrical devices m...
...Thermal Conductive Pad Gap Filling Materials Silicone Thermal Pad For LED CPU Laptop Product descriptions TlF®100-06S Series is a silicone based, thermally conductive gap pad. Its unreinforced construction a...
TIF100-65-11ES Premium Soft CPU Silicone Thermal Pad Low Thermal Resistance Thermal Gap Filler For Advanced Cooling Needs Product descriptions TIF®100-65-11ES Series thermally conductive interface materials are...
...Thermal Pad With Thermal Conductivity 1.2W/M.K Work For Computer Laptop Desktop CPU Cooling Products description Ziitek TIF™100-20-11PSA series is a silicone based, thermally conductive gap pad. Its unreinfo...
...CPU High Thermal Conductivity Die Cut Silicon Thermal Pad For AI Processors AI Servers The TIF®700PU Series is a thermal pad specifically designed to tackle the high level cooling challenges and environments...
... material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness,achievin...
... conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink. Features...
... cooling requirements while also ensuring excellent assembly workability. Through an innovative material formulation, it successfully achieves an ideal combination of ultra-high thermal conductivity and mode...
...fillers to provide both excellent thermal conductivity and superior softness. Compared to conventional thermal greases, TIF®050-11 has a high erviscosity, which effectively prevents filler separation from th...
Thermal Conductive Gel Silicone Heat Transfer Gel For Heat Sink Dissipate Heat TIF®035-05 is a soft silicone gel-based gap filer pad, formulated with a special blend of filers to provide both excellent thermal ...
... blend of fillers to provide both high thermal conductivity and superior softness. Compared to conventional thermal greases, it has a higher viscosity, which effectively prevents filler separation from the s...
Naturally tacky blue Good Thermal Conductive pad For CPU Heat Dissipation 1.5 W/mK RoHS compliant TIF100-05E 35 Shore 00 The TIF100-05E Series thermally conductive interface materials are applied to fill the ai...
Compressible CPU Thermal Pad for High Speed Mass Storage Drives Blue 5.5 MHz Dielectric Constant The TIF™500S Series thermally conductive interface materials are applied to fill the air gaps between the heating...
3W/Mk Soft Compressible Thermal Conductive Pad For LED Heat Dissipation 3.1g/Cm³ Specific Gravity for Computer CPU/GPU Cooling Products description The TIF®100-30-10F Series is a structurally supportive thermal...
TIF100-20-05S blue High Thermal Conductive Pad For CPU Heat Dissipation 2.95 g / cc Specific Gravity 2.0W/mK​ The TIF100-20-05S thermally conductive interface materials are applied to fill the air gaps between ...
Soft Safe Simple To Apply Anti-Static Thermal Conductive Silicone Pads For Ssd Cpu Gpu Led Ic Chipset Cooling The TIF®100-15-11S thermally conductive interface materials are applied to fill the air gaps between...
... thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD ......
Thermal Gap Filler Designed for Heat Dissipation in LED TV and LED Lit Lamps Replacing Bergquist Sil-PAD900 for CPU Cooling Product Overview The TIF®100-16-38UF is an electrically insulating, thermally conducti...
Cpu Thermal Pad 4.0W/MK With 45 Shore 00 Hardness For RDRAM Memory Modules The TIF100-40-11S Series is recommended for applications that require a minimum amount of pressure on components. The viscoelastic natu...