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Hardness 20 Shore 00 Good Insulation Performance 4.5mmt Thermal Conductive Gap Filler Pad For Video Capture Board Company Profile Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006...
3.0g/cm³ Rohs Compliant Thermal Pad Silicone High Durability For Routers Company Profile With professional R&D capabilities and over 13 year experiences in thermal interface material industry, Ziitek company ow...
Silicone Thermal Pad 10.0W High Temperature Heat Conductive Insulation Materials TIF®100C 10075-11 series is a silicone-based thermal material designed to fill the gaps between heat-generating components and li...
Factory Direct Sale Fiberglass Thermally Conductive Insulator Pad Efficient Heat Dissipation Silicon Pad Insulation The TIS®806K-09-01 Series of products are highly efficient insulating products and they also h...
Extremely Soft 6.5W/M-K Thermal Conductive Silica Gap Pad For Telecom Equipment Company Profile Ziitek company is a high-tech enterprise dedicated to the R&D, manufacture and sales of thermal interface material...
Extremely Soft 6.5W/M-K Thermal Conductive Silica Gap Pad For Telecom Equipment Company Profile Ziitek company is a high-tech enterprise dedicated to the R&D, manufacture and sales of thermal interface material...
Particularly Soft 1.5W/MK Thermal Gap Filler Pad For AI Processors AI Servers Company Profile Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise speciali...
Green 1.8W/mK Thermal Gap Filler For Unmanned Aerial Vehicle Uav Products description The TIF®100-18-56U Series is an ultra-soft thermal interface material designed specifically to protect precision components ...
...Thermal Adhesive Tape , White Adhesive Tape for LED Aluminum Plate Heat Dissipation The TIA™800FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumptio...
...Thermally Conductive Adhesive Transfer Tape with 0.1mm / 0.5mm Thickness The TIA™810FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semicondu...
... bonding strength with low thermal impedance, with which in effect can be able to replace the method of lubricating grease and mechanical fixing. Features Thermal Conductivity 0.9W/mK. High bond strength to ...
... power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of lubricating grease and ...
... and other power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of lubricating g...
...Thermally Adhesive Tape For LED Mount Heat Sink Conductive tape 0.9 W/MK The TIA™810FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semicondu...
...Thermal Adhesive Tape 1.2 W/mK For Led Fluorescent Lamp 0.1~0.5mmT The TIA™800FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors....
...Thermal Adhesive Tape For LED Mount Heat Sink with 0.8 W/mK double adhesive The TIA™820FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semico...
...thermal adhesive double side tape fire resistance equate 94 V-0 The TIA™605P Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. Th...
Thermal conductive adhesive fire resistance tape TIA608P 0.2mm thickness for bonding heat microprocessors The TIA608P Series products are mostly used for bonding heat dissipation fins, microprocessors and other...
...fins, microprocessors and other power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the me...
...Thermal Adhesive Tape with double-sided adhesive The TIA™800FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhe...