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...Thermal Gap Filler Pad Heat Sink Thermal Pad Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in ...
Thermal Management Materials 3.0W Silicone Head Sink Thermal pad for Electric Parts Heat Transfer Company profile Ziitek company is a high-tech enterprise dedicated to the R&D, manufacture and sales of thermal ...
...heat sink thermal pad TIF500-40-11US 4.0W/mK thermal conductivity high performance Company Profile Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and man...
Thermal Management 1.5W/MK Thermal Gap Pad With Excellent Adhesion To Rough Surfaces Company profile Dongguan Zhaoke Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise s...
...ch generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. TIF700HZ-Series-Datahseet.pdf Ziitek TIF7140HZ is a sil...
... printed on thermal sublimation transfer paper, and then through the thermal transfer equipment heated to 200C or so, the thermal transfer ink on the thermal sublimation paper will be in the form of gasifica...
...Thermal Pad Thermal Gap Pad For Motherboard LED Graphics Card GPU CPU Company Profile Dongguan Zhaoke Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing ...
...Thermal Conductivity Medical equipment silicone Thermal Pad Company Profile Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the res...
...Thermal Conductive Carbon Fibre Based Thermal Pad For 5G Communication Equipment Company profile Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise sp...
...Thermal Gap Filler Pad Thermal Conductive Silicone Pad For LED CPU GPU EV Battery TS-TIF®100C 6050-11 series is a silicone-based thermal material designed to fill the gaps between heat-generating components ...
...Thermal Insulation Silicone Thermal Gap Pad For PCB TS-TIF®100C 5045-11 series is a silicone-based thermal material designed to fill the gaps between heat-generating components and liquid cooling plates or m...
... and liquid cooling plates or metal bases. lts flexibility and elasticity make it ideal for covering highly uneven surfaces. With excellent thermal conductivity, it efficiently transfers heat from heat-gener...
...Thermal Paper Rolls for Lottery ATM Labels & Records Thermal Paper Information Material Virgin Wood Pulp & Heat Sensitive Paint Color White Size 400mm 405mm 565mm Custommize Size Grammage 55g 65g 70g 80g Pac...
Thermal Pad 0.5mm 1mm 1.5mm 2mm Highly Efficient Thermal Conductivity 5.0 W/MK Company Profile Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise special...
...Thermal Gap Filler Pad Silicone Thermal Pad TIF®100 10055-62 series of thermal interface materials is specifically designed to fill air gaps between heat-generating components and heat sinks or metal basepla...
...Thermal Gap Pad 0.3mm to 5.0mm Thick 6.0W/M·K Silicone Thermal Pad TS-TIF®100C 6050-11 series is a silicone-based thermal material designed to fill the gaps between heat-generating components and liquid cool...
Thermal Conductive Silicone Pad 8.0 W/M-K High-Temperature Insulation Gap Pad GPU Laptop Thermal Conductive Pad TS-TIF®100C 8045-11 series is a silicone-based thermal material designed to fill the gaps between ...
... and liquid cooling plates or metal bases. lts flexibility and elasticity make it ideal for covering highly uneven surfaces. With excellent thermal conductivity, it efficiently transfers heat from heat-gener...
...Thermal Conductive Silicone Pad Thermal Pad Thickness 0.5 to 5.0mm Thermal gap filler pad Product description TIF100-10-02S Series is not only designed to take advantage of the gap heat transfer, to fill gap...
... specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conductin...