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...Thermal Resistance 1.4W/m.K Thermal Insulation Silicone Pad For IGBT Attribute Value Test Method Product TC1500B - Composition Silicone + Fiberglass Carrier - Color Yellow Visual Thickness(mm) 0.25 astm d374...
4.0W Insulation Silicone Thermal Conductive Sheet TIF100-4010S Silicone Thermal Transfer Pad For Battery CPU Product descriptions TlF100-40-10S is recommended for applications that require a minimum amount of...
...Thermal Interface Material Phase Change for High Power LED Lights TIC™805G series is low melting point thermal interface material. At 50℃, TIC™800G series begins to soften and flow, filling the microscopic i...
... with a pre-flash viscosity of 80 Pa·s, post-flash viscosity of 700 Pa·s, thermal conductivity of 6.2 W/m·K, thermal resistance of 6.1 mm²·K/W, and bond line thickness of 26 μm. Product Overview Optimized fo...
5.0W/m-k high cost-effective 1.5mmT thermal gap pad TIF560-50-11US with grey color for routers Ziitek TIF560-50-11US is recommended for applications that require a minimum amount of pressure on ......
good performance High tack surface reduces contact resistance High durability thermal pad for routers,2.0mmT The TIF180-50-11US is not only designed to take advantage of the gap heat transfer, to fill gaps, com...
0.5mmT Outstanding thermal performance 18 shore 00 silicone pads for display card The TIF120-30-05US is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer bet...
2.5mmt Low Cost and High Durability Thermal Pad for Power Supply The TIF1100-30-06UF is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the mater...
Fire Rating 94 V0 Conductive Pads Outstanding Thermal Performance for ATE The TIF1180-30-06UF is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between he...
2.5mm Gray Outstanding Thermal Performance Conductive Pads For Display Card The TIF1100-10UF is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of t...
75 Shore 00 High Tack Surface Reduces Contact Resistance Thermal Pad for Notebook The TIF1180-05UF is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer betwe...
Electrically Isolating Gray TIF140N-50-10F Thermal Pad for LED TV The TIF140N-50-10F is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the mater...
High Cost-effective China Thermal Pad With 2.0mmT Thickness For Automotive Electronics The TIF780Z is recommended for applications that require a minimum amount of pressure on components. The viscoelastic natur...
Wholesale Silicone Thermal Pad Distributor for LED Lamp CPU GPU Cooling Ziitek TIF720HP is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating ...
UL recognized thermally conductive silicone rubber For power supply,outstanding thermal performance :3.0 W/MK The TIF5160-30-11US Series is recommended for applications that require a minimum amount of pressure...
TIFTM100-02S Termal Pad 1.5W 1mm 2mm 3mm 5mm Cooling Silicone Thermal Conductive Pads For CPU LED Laptop Product descriptions TlFTM100-02S Series is recommended for applications that require a minimum amount of...
OEM Color Fast Heating Thermal Heating Pad With Overheating Protection 37~80/100~176 Product Description: The Heating Pad Warmer is an electric heat pad designed for household temperature relief and comfort...
... grease composed of thermally conductive fillers and a siloxane polymer matrix, delivering 1.0 W/mK thermal conductivity with high-temperature stability. Product Description Formulated with metal oxide-fille...
... compound based on a polydimethylsiloxane matrix with thermally conductive fillers. It has a viscosity of 100,000 cP, a specific gravity of 3.5, and a non-volatile content of 99.95%, designed for MPU ......
...Thermal Interface Materials Thermal Phase Changing Material The TIC™800P series is low melting point thermal interface material. At 50℃, TIC™800P series begins to soften and flow, filling the microscopic irr...