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...Thermal Copper Foil Tape Product Description Item: Heat Resistant Tape Thermal Adhesive PCB LED Silicon Copper Foil ~ copper foil tapes uses copper foil as substrate and single sided coated with conductive a...
...ked pressure-sensitive adhesive single-sided coated thermal release tape. It has a high initial adhesion and easily is peeled off by heating under a certain high temperature(145℃). Features And Benefits: 1. ...
Thermal Insulation Led module Double Sided Fabric Thermally Conductive Adhesive Tape The TIA802 Series is filled with good thermal conductivity ceramic particles, featuring excellent thermal conductivity, stro...
...Thermally Conductive Adhesive Transfer Tape with 0.1mm / 0.5mm Thickness The TIA™810FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semicondu...
...Thermal Adhesive Tape Easy To Stamping Processing For LED Mount Heat Sink The TIA™808FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semicond...
... power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of lubricating grease and ...
...Thermal Conductive Acrylic Tape for LED strip The TIA™800FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesiv...
...Thermal Adhesive Tape 1.2 W/mK For Led Fluorescent Lamp 0.1~0.5mmT The TIA™800FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors....
...Thermal Adhesive Tape For LED Mount Heat Sink with 0.8 W/mK double adhesive The TIA™820FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semico...
...thermal adhesive double side tape fire resistance equate 94 V-0 The TIA™605P Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. Th...
Thermal conductive adhesive fire resistance tape TIA608P 0.2mm thickness for bonding heat microprocessors The TIA608P Series products are mostly used for bonding heat dissipation fins, microprocessors and other...
...fins, microprocessors and other power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the me...
...Thermal Adhesive Tape with double-sided adhesive The TIA™800FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhe...
...thermal Adhesive Tape for Heatsink The TIA™800FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesive tape pos...
...Tape Ceramic-coated mica tape is a high-performance material used primarily for its exceptional thermal and electrical insulation properties. Here’s a detailed overview: Features: Base Material: Comprised of...
..., and it can protect the chip module due to the high heat in the card-based laser barcode process and play a role in heat insulation and avoid thermal necrosis of the module. This product is a...