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...) ≥5.0 ASTM D149 Dielectric Constant(@10mhz) 7.3 ASTM D150 Volume Resistivity(Ω.cm) 1.0*1014 ASTM D257 Flammability V-0 UL94 Thermal Thermal conductivity(W/m.K) 3.0 ASTM D5470 Product feature ■ Thermal condu...
...Thermal Conductivity Gap Filler For LEDs Attribute Value Test Method Composition Ceramic filler + Silicone - Color Green Visual Density(g/cc) 2.9 ASTM D792 Extrudability(g/s) 5.0 ISO9048 Usage Temperature(℃)...
...) ≥5.0 ASTM D149 Dielectric Constant(@10mhz) 7.3 ASTM D150 Volume Resistivity(Ω.cm) 1.0*1014 ASTM D257 Flammability V-0 UL94 Thermal Thermal conductivity(W/m.K) 3...
...) ≥5.0 ASTM D149 Dielectric Constant(@10mhz) 7.3 ASTM D150 Volume Resistivity(Ω.cm) 1.0*1014 ASTM D257 Flammability V-0 UL94 Thermal Thermal conductivity(W/m.K) 3.0 ASTM D5470 Product feature ■ Thermal condu...
...) ≥5.0 ASTM D149 Dielectric Constant(@10mhz) 7.3 ASTM D150 Volume Resistivity(Ω.cm) 1.0*1014 ASTM D257 Flammability V-0 UL94 Thermal Thermal conductivity(W/m...
...) ≥5.0 ASTM D149 Dielectric Constant(@10mhz) 7.3 ASTM D150 Volume Resistivity(Ω.cm) 1.0*1014 ASTM D257 Flammability V-0 UL94 Thermal Thermal conductivity(W/m.K) 3.0 ASTM D5470 Product feature ■ Thermal condu...
...) ≥5.0 ASTM D149 Dielectric Constant(@10mhz) 7.3 ASTM D150 Volume Resistivity(Ω.cm) 1.0*1014 ASTM D257 Flammability V-0 UL94 Thermal Thermal conductivity(W/m.K...
...) ≥5.0 ASTM D149 Dielectric Constant(@10mhz) 7.3 ASTM D150 Volume Resistivity(Ω.cm) 1.0*1014 ASTM D257 Flammability V-0 UL94 Thermal Thermal conductivity(W/m.K...
Thermally Conductive Encapsulant Gray Elastomer With Moderate Thermal Conductivity Attribute Value Test Method Composition Ceramic filler + Silicone - Color/Component A White Visual Color/Component B Sliver Gre...
...fillers to provide both excellent thermal conductivity and superior softness. Compared to conventional thermal greases, TIF®050-11 has a high erviscosity, which effectively prevents filler separation from th...
Thermal Conductive Gel Silicone Heat Transfer Gel For Heat Sink Dissipate Heat TIF®035-05 is a soft silicone gel-based gap filer pad, formulated with a special blend of filers to provide both excellent thermal ...
... Thermally Conductive Gel Adhesive Injector Cpu Gpu TIF®040-12 is a soft silicone gel-based gap filer pad, formulated with a special blend of filers to provide both excellent thermal conductivity and superi...
...thermal pad 27shore00 3.5mmT thermal gap filler pad TIF3140 2.8W conductivity for cooling electronic elements The TIF3140 Series is recommended for applications that require a minimum amount of pressure on c...
...thermal conductive pad, ultra soft 20shore00 For High speed mass storage drives Ziitek TIF5160-50-11US is an extremely soft gap filling material rated at a thermal conductivity of 5.0 W/m-K. It is specially ...
...thermal conductive gap pad 20±5 Shore 00,3.0 W/m-K for mainboard/mother board The TIF1160-30-11US is an extremely soft gap filling material rated at a thermal conductivity of 3.0 W/m-K. It is specially formu...
... for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra low modulus resin formulation...
...Thermal Conductive Graphite Sheet For Mass Storage Devices Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high per...
High Conductive Insulation Thermal Silicone Pad Cooling Gap Filler For Semiconductor, Medical Equipment, Mask Aligner Company Profile With a wide range, good quality, reasonable prices and stylish designs, Ziit...
...Thermal Conductive Gap Filler Pads Ideal For Heat Dissipation In Electronic And Industrial Equipment Company Profile Dongguan Ziitek Electronic Material and Technology Ltd. is a professional manufacturer of ...