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... Ultrasonic Frequency Measuring Instrument For Ultrasonic Grinder Description: Impedance Analyzer is mainly used for piezoelectricity element impedance analysis and parameter calculation. Before using piezoe...
... Thicknes: 4.0mm Min. Distance Between Line and Width: 0.1mm/0.1mm The minnimum Distance of Via to Trace: 0.175 mm Size: 750mm*282mm Min. Hole Size: 0.2mm Process ENIG Ratio of Thickness to Via Diameter 12:1...
... gold/ Ni/Au plating gold finger/OSP processing/immersion Tin (Sn) Layers single-sided,double-sided Min trace width 6mil Min space width 6mil Min trace to pad/pad to pad space 6mil Min drill diameter 0.2mm M...
... gold/ Ni/Au plating gold finger/OSP processing/immersion Tin (Sn) Layers single-sided,double-sided Min trace width 6mil Min space width 6mil Min trace to pad/pad to pad space 6mil Min drill diameter 0.2mm M...
.... Line Width: 0.05mm Min. Hole Size: 0.15mm PTH Min. PTH Hole Ring: 0.45mm Min. Gap between Cover Layer and Pad: 0.1mm Min. Gap between Trace and Outline: 0.2mm Trace Width Tolerance: +/-0.03mm, W+/-30% Outl...
... layers 3 Min base copper thickness 1/3 OZ (12um) 4 Max finished copper thickness 10 OZ (350um) 5 Min trace width/spacing(Inner layer) 2/2mil (0.05mm) 6 Min trace width/spacing(Outer layer) 2/2mil (0.05mm) 7...
... layers 3 Min base copper thickness 1/3 OZ (12um) 4 Max finished copper thickness 10 OZ (350um) 5 Min trace width/spacing(Inner layer) 2/2mil (0.05mm) 6 Min trace width/spacing(Outer layer) 2/2mil (0.05mm) 7...
.... Line Width: 0.05mm Min. Hole Size: 0.15mm PTH Min. PTH Hole Ring: 0.45mm Min. Gap between Cover Layer and Pad: 0.1mm Min. Gap between Trace and Outline: 0.2mm Trace Width Tolerance: +/-0.03mm, W+/-30% Outl...
... and inductances get reduced when using small blind and buried vias. Since there are no stubs, the impedance of microvias is close to the trace impedance. The stray capacitance of a normal via is much higher...
... and inductances get reduced when using small blind and buried vias. Since there are no stubs, the impedance of microvias is close to the trace impedance. The stray capacitance of a normal via is much higher...
... and inductances get reduced when using small blind and buried vias. Since there are no stubs, the impedance of microvias is close to the trace impedance. The stray capacitance of a normal via is much higher...
... and inductances get reduced when using small blind and buried vias. Since there are no stubs, the impedance of microvias is close to the trace impedance. The stray capacitance of a normal via is much higher...
...trace/space: 0.1mm Blind and buries via and via in pad Material: FR4, high Tg RoHS Directive-compliant Board thickness: 0.4-5.0 mm +/-10% Layer count: 1-22 layers Copper weight: 0.5-5oz Min finish hole side:...
...% Layer count: 1-22 layers Copper weight: 0.5-5oz Min finish hole side: 8 mils Laser drill: 4 mils Min trace width/space: 4/4 mils (production), 3/3 mils (sample run)...
...trace/space: 0.1mm • Blind and buries via and via in pad Material: FR4, high Tg RoHS Directive-compliant Board thickness: 0.4-5.0 mm +/-10% Layer count: 1-22 layers Copper weight: 0.5-5oz Min finish hole sid...
...% Layer count: 1-22 layers Copper weight: 0.5-5oz Min finish hole side: 8 mils Laser drill: 4 mils Min trace width/space: 4/4 mils (production), 3/3 mils (sample run) Solder mask: green, blue, white, black,...
...trace/space: 0.1mm • Blind and buries via and via in pad Material: FR4, high Tg RoHS Directive-compliant Board thickness: 0.4-5.0 mm +/-10% Layer count: 1-22 layers Copper weight: 0.5-5oz Min finish hole sid...
...% Layer count: 1-22 layers Copper weight: 0.5-5oz Min finish hole side: 8 mils Laser drill: 4 mils Min trace width/space: 4/4 mils (production), 3/3 mils (sample run) Solder mask:...