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...% Layer count: 1-22 layers Copper weight: 0.5-5oz Min finish hole side: 8 mils Laser drill: 4 mils Min trace width/space: 4/4 mils (production), 3/3 mils (sample run) Solder mask:...
...% Layer count: 1-22 layers Copper weight: 0.5-5oz Min finish hole side: 8 mils Laser drill: 4 mils Min trace width/space: 4/4 mils (production), 3/3 mils (sample run) Solder mask: green, blue, white, black, ...
...trace/space: 0.1mm • Blind and buries via and via in pad Material: FR4, high Tg RoHS Directive-compliant Board thickness: 0.4-5.0 mm +/-10% Layer count: 1-22 layers Copper weight: 0.5-5oz Min finish hole sid...
...% Layer count: 1-22 layers Copper weight: 0.5-5oz Min finish hole side: 8 mils Laser drill: 4 mils Min trace width/space: 4/4 mils (production), 3/3 mils (sample run)...
...trace/space: 0.1mm • Blind and buries via and via in pad Material: FR4, high Tg RoHS Directive-compliant Board thickness: 0.4-5.0 mm +/-10% Layer count: 1-22 layers Copper weight: 0.5-5oz Min finish hole sid...
... Advantage 1: Advanced Engineering for Precision PCB Manufacturing • High-Density Stack-Up: 2-48 layer boards with blind/buried vias, 3/3mil trace/spacing, ±7% impedance control, ideal for 5G, industrial...
... PCB Manufacturing • High-Density Stack-Up: 2-48 layer boards with blind/buried vias, 3/3mil trace/spacing, ±7% impedance control, ideal for 5G, industrial control, medical devices, and automotive electronic...
... PCB Manufacturing • High-Density Stack-Up: 2-48 layer boards with blind/buried vias, 3/3mil trace/spacing, ±7% impedance control, ideal for 5G, industrial control, medical devices, and automotive electronic...
... PCB Manufacturing • High-Density Stack-Up: 2-48 layer boards with blind/buried vias, 3/3mil trace/spacing, ±7% impedance control, ideal for 5G, industrial control, medical devices, and automotive electronic...
... PCB Manufacturing • High-Density Stack-Up: 2-48 layer boards with blind/buried vias, 3/3mil trace/spacing, ±7% impedance control, ideal for 5G, industrial control, medical devices, and automotive electronic...
... PCB Manufacturing • High-Density Stack-Up: 2-48 layer boards with blind/buried vias, 3/3mil trace/spacing, ±7% impedance control, ideal for 5G, industrial control, medical devices, and automotive electronic...
... PCB Manufacturing • High-Density Stack-Up: 2-48 layer boards with blind/buried vias, 3/3mil trace/spacing, ±7% impedance control, ideal for 5G, industrial control, medical devices, and automotive electronic...
... Advantage 1: Advanced Engineering for Precision PCB Manufacturing • High-Density Stack-Up: 2-48 layer boards with blind/buried vias, 3/3mil trace/spacing, ±7% impedance control, ideal for 5G, industrial...
... Advantage 1: Advanced Engineering for Precision PCB Manufacturing • High-Density Stack-Up: 2-48 layer boards with blind/buried vias, 3/3mil trace/spacing, ±7% impedance control, ideal for 5G, industrial...
... Advantage 1: Advanced Engineering for Precision PCB Manufacturing • High-Density Stack-Up: 2-48 layer boards with blind/buried vias, 3/3mil trace/spacing, ±7% impedance control, ideal for 5G, industrial...
... Advantage 1: Advanced Engineering for Precision PCB Manufacturing • High-Density Stack-Up: 2-48 layer boards with blind/buried vias, 3/3mil trace/spacing, ±7% impedance control, ideal for 5G,...
... Advantage 1: Advanced Engineering for Precision PCB Manufacturing • High-Density Stack-Up: 2-48 layer boards with blind/buried vias, 3/3mil trace/spacing, ±7% impedance control, ideal for 5G, industrial con...
... Advantage 1: Advanced Engineering for Precision PCB Manufacturing • High-Density Stack-Up: 2-48 layer boards with blind/buried vias, 3/3mil trace/spacing, ±7% impedance control, ideal for 5G, industrial...
... Advantage 1: Advanced Engineering for Precision PCB Manufacturing • High-Density Stack-Up: 2-48 layer boards with blind/buried vias, 3/3mil trace/spacing, ±7% impedance control, ideal for 5G, industrial...
... Advantage 1: Advanced Engineering for Precision PCB Manufacturing • High-Density Stack-Up: 2-48 layer boards with blind/buried vias, 3/3mil trace/spacing, ±7% impedance...