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Product Description: The Semiconductor Cleaning Machine is an automatic cleaning device that is designed to effectively remove water-based flux and other types of contamination from various electronic component...
A semiconductor quartz insert ring is a high-purity, precision-engineered ring made from fused quartz, crucial in semiconductor etching to guide etching gases, control plasma, and shield wafers from contaminati...
High Transparency Round Quartz Lens for Wafer Defect Inspection Machines quartz lens function to manipulate light by refracting, reflecting, and focusing it, similar to a glass lens, but with superior propertie...
TIMO120 Thermal Camera Core Miniature VOx FPA 120x90 / 17μm Thermal Imaging Camera Core Integrated in Infrared Cameras Product Description TIMO120 miniature infrared module integrates wafer-level optics, 120x90...
... / 17μm wafer level package (WLP) infrared imaging detector that adopts the market preferred VOx material. Thanks to the wafer level packaging technology, the WLP infrared detector has simpler manufacturing ...
TIMO120 Thermal Camera Core Miniature VOx FPA 120x90 / 17μm Thermal Imaging Camera Core Integrated in Infrared Cameras Product Description TIMO120 miniature infrared module integrates wafer-level optics, 120x90...
TIMO120 Thermal Camera Core Miniature VOx FPA 120x90 / 17μm Thermal Imaging Camera Core Integrated in Infrared Cameras Product Description TIMO120 miniature infrared module integrates wafer-level optics, 120x90...
TIMO120 Thermal Camera Core Miniature VOx FPA 120x90 / 17μm Thermal Imaging Camera Core Integrated in Infrared Cameras Product Description TIMO120 miniature infrared module integrates wafer-level optics, 120x90...
... (WLP) infrared imaging detector, high performance signal processing circuit and image processing algorithm. Thanks to the wafer level packaging technology, the WLP infrared detector has simpler manufacturin...
... resolution and 17μm pixel size. It also has an optional thermographic function with measurement range from -20℃~550 ℃ for industrial temperature measurement. Thanks to the wafer level packaging technology, ...
..., 120x90 / 17μm wafer level package (WLP) detector and basic image processing circuit to quickly obtain thermal images of the target area and heat distribution. ......
..., high performance signal processing circuit and image processing algorithm. Thanks to the wafer level packaging technology, the WLP infrared detector has simpler manufacturing process and easier to be integ...
...Camera Module 1.4mm With LED Light FOV120 Specificaitons AssemblytechniqueImage Sensor OVM6948SMT(ROSH) Output Interface USB2.0 UVC Frame Rate 200x200 Sensor CMOS Style Mini Camera Effective Pixels 200*200 ...
...Camera COIN612R 640x512 / 12μm Drone Thermal Camera with Aerial Thermography and Clear Imaging Product Description COIN612R is a radiometric thermal camera for drones and can be widely used in the area of in...
...Camera Product Description iLC212 includes an exceptionally small size 256x192 / 12μm wafer level package (WLP) infrared detector that captures long-wave infrared (LWIR) spectrum that ranges from 8 to 14μm. ...
...Camera Core 256x192 12μm + 3.2mm Lens for Security Camera Product Description iLC212 uncooled IR imaging module integrates the 256x192 / 12μm focal plane array wafer level package (WLP) infrared detector and...
...256x192 / 12μm focal plane array wafer level package (WLP) infrared detector and can capture long-wave infrared (LWIR) spectrum that ranges from 8 to 14μm. Oriented for fully optimized SWaP-C, the iLC212 the...
...-capable and has available infrared non-contact temperature measurement function. It includes an exceptionally small size 256x192 / 12μm wafer level package (WLP) infrared detector that captures long-wave in...
... infrared module is a new generation version of COIN417 developed by SensorMicro. It integrates 400x300@17μm wafer level package (WLP) infrared imaging detector, high performance signal processing circuit an...