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...Level Output Current: 100 uA Supply Voltage - Max: 3.4 V Supply Voltage - Min: 3.1 V Minimum Operating Temperature: - 25 C Maximum Operating Temperature: + 150 C Package / Case: SOIC-Narrow-16 Packaging: Ree...
... in Celsius (Centigrade) • Linear + 10-mV/°C Scale Factor • 0.5°C Ensured Accuracy (at 25°C) • Rated for Full −55°C to 150°C Range • Suitable for Remote Applications • Low-Cost Due to Wafer-Level Trimming • ...
...WAFER Package, IP65 level and shockproof, safe data protection. Slim size, huge data capacity inside. Easy way to assemble different shape or cover into a USB flash drive. What is important inside UDP? Memor...
...Wafer Box 25PCS Press Type Recyclable 2 Inch Rectangular Press Type Design Transparent Color Wafer Transport Box Our company has skillful and well-trained team in the field of Semiconductor packaging design ...
...Chips Manufacturing Machine , Slice Potato Wafer Making Machine Application: potato chips (plain, ruffles) banana chips Introduction of Automatic Potato Chips production line The professional automatic potat...
...potato chips/food plastic packing machine Product Description 1.Z Type Elevator (1) The hoist and supporting the use of electronic scales and control circuit level control (2) Automatic feeding and stop auto...
...potato chips/food plastic packing machine Product Description 1.Z Type Elevator (1) The hoist and supporting the use of electronic scales and control circuit level control (2) Automatic feeding and stop auto...
...chip adopts Homsh Technology's self-owned intellectual property iris algorithm PhaseIris HWTM (Patent No.: ZL 201410430535.2), integrates 6 matching cores, and relies on technologies such as FPGA multi-core ...
...chip adopts Homsh Technology's self-owned intellectual property iris algorithm PhaseIris HWTM (Patent No.: ZL 201410430535.2), integrates 3 encoding cores, and relies on technologies such as FPGA multi-core ...
...Wafers General type high-precision IC bonder, which is suitable for mass wafer loading products, SIP packaging, Memory Stack Die (memory stack), CMOS, MEMS and other processes. Features: Multilayer capabilit...
...level grayscale PWM adjustment and 32 brightness digital rgb chip 1. General description LC8822 is a two-wire transmission channel three (RGB) driving intelligent control circuit and the light emitting circu...
Stainless Steel Vertical Automatic Weighing Nuts/Chips Scale Packing Machine Be Composed Of 1: SUN-320 Packing Machine 2:Z-Type Hoist 3: SUN-10 Scale 4:Support 5:Conveyer Application Scale Packing Machine is su...
Stainless Steel Vertical Automatic Weighing Nuts/Chips Scale Packing Machine Be Composed Of 1: SUN-320 Packing Machine 2:Z-Type Hoist 3: SUN-10 Scale 4:Support 5:Conveyer Application Scale Packing Machine is su...