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...Chip Scale Package Transporting IC Factory Customized 3-Inch Anti-Static Tray To Load The Bar In Chip Level Package Hiner-pack supplies a wide range of Matrix trays and shipping IC trays for safely storing a...
TPS63036YFGR Power Management ICs High-Efficiency Buck-Boost Converter in Tiny Wafer Chip Scale Package 8-UFBGA Product Status Active Function Step-Up/Step-Down Output Configuration Positive Topology Buck-Boost...
Product Description: The Semiconductor Cleaning Machine is an automatic cleaning device that is designed to effectively remove water-based flux and other types of contamination from various electronic component...
... of Fan-Out 2.5D Chip on Wafer on Substrate (CoWoS) processes. Equipped with dedicated underfill valves, the SS101 precisely dispenses fine volumes for small bump and narrow ......
...°C to 150°C Range Suitable for Remote Applications Low-Cost Due to Wafer-Level Trimming Operates From 4 V to 30 V Less Than 60-μA Current Drain Low Self-Heating, 0.08°C in Still Air Non-Linearity Only ±1⁄4°C...
... adopts the Wafer Level Packaging (WLP) technology that has low cost and high yield on the market. Thanks to the wafer level packaging, the GST412W thermal infrared detector could produce clear infrared ther...
...Chip QCS-2290-0-NSP752-MT-00-0 Dual-Channel System On Chip QFN Package Product Description Of QCS-2290-0-NSP752-MT-00-0 QCS-2290-0-NSP752-MT-00-0 is robust entry-level offering, enabling reliable performance...
...Level Henna Powder Packaging Machine Guangzhou Product Description Model HDF-B302C Bag width 25-145mm Bag length 30-180mm Filling range 40-220ml Packing speed 20-60 bags/min Power 220v/2.2kw Size 650*1050*19...
...Scale Packaging Machine Applications: Applicable to the automatic packaging of granular, flake,blockand other products with a diameter of not more than 6cm in thechemical, food, health care and pharmaceutica...
... (potato chips) Https://www.youtube.com/watch?v=AqiAZramjX4 4 heads weigher powder packing machine Trade Assurance Supplier Multi-Function Small Scale Packaging Machine For Popcorn / Sugar / Crisps /Peanut F...
ANALOG DEVICES ADA4841 IC integrated circuit mcu chip ADA4841 Electronic Components The ADA4841 offers a high performance at a very low cost 266 MHz/1596 MFLOPs -- within the third generation SHARC Processor fa...
SN74AHC123AD New And Original SOP16 Integrated Circuit ISO9001.pdf Product Technical Specifications EU RoHS Compliant ECCN (US) EAR99 Part Status Obsolete HTS 8542.39.00.01 SVHC Yes Automotive No PPAP No Logic ...
Large Scale Wafer Cone Making Machine with CE Features of Wafer Cone Making Machine Are you ready to take your wafer cone production to the next level? Look no further than our incredible Large Scale Wafer Cone...
...Wafer Box Wafer Carrier Container Box Silicon Sapphire Box for 300mm semiconductor wafer shipping 2inch/3inch/4inch/6inch/8inch single wafer container box Waterproof 12 Inch Single Wafer Carrier Box Environm...
...crystal material. The design integrates temperature compensation, output zero and full-scale calibration, and amplification functions into a single silicon chip through a monolithic silicon wafer design. Pin...
...Suitable for Remote Applications • Low Cost Due to Wafer-Level Trimming • Operates from 4 to 30 V • Less than 60-μA Current Drain • Low Self-Heating, 0.08°C in Still Air • Nonlinearity Only ±¼°C Typical • Lo...
...Wafer Coating Description: Wafer coating is a unique process that facilitates the automatic application of chip bonding adhesives at the wafer level, followed by the formation of chip bonding films in the ne...
...Wafer 4'' 6'' 8'' for MEMS Devices Glass wafers made of borosilicate glass are often used in Semiconductor and MEMS industry in a wide variety of applications. These wafers can be used for the encapsulation ...
... in Celsius (Centigrade) • Linear + 10-mV/°C Scale Factor • 0.5°C Ensured Accuracy (at 25°C) • Rated for Full −55°C to 150°C Range • Suitable for Remote Applications • Low-Cost Due to Wafer-Level Trimming • ...